SR2NH H67388 Stencil Solder Station Kits
SR2NH H67388 Stencil Solder Station Kits
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
SR2NH H67388 Stencil Solder Station Kits
i3-3110M SR0N1 Stencil Template 90*90
i5-7200U SR2ZU Stencil Template 90*90
i7-4700HQ SR15E Stencil Template 90*90
i3-4010U SR16Q Stencil Template 90*90