Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
16 other products in the same category
FM880PAAY43KA Stencil Template 90x90
FM880PAAY43KA Stencil Template 90*90
GTX1050TI N17PG1A1 Stencil Template
GTX1050TI N17P-G1-A1 Stencil Template
Universal Stencil Template 27pcs 90x90mm
Universal 27pcs 90mm*90mm Stencil Template
N16EGSKABA1 Stencil Template 90x90
N16E-GS-KAB-A1 Stencil Template 90*90
Stencil Holder Reballing Station BGA Solder Station With Magnet90x90
ZQT-90X BGA Reballing Station 80*80 90*90 Stencils Reballing Station BGA Solder Station
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template
GL82H170 SR2C8 Stencil Template 90x90
GL82H170 SR2C8 Stencil Template 90*90
V537A426SR2FQ Stencil Template 90x90
V537A426SR2FQ Stencil Template 90*90