6in1 MSM8953 MSM8937 MSM8998 8916 SDM450 Stencil Template
6in1 MSM8953 MSM8937 MSM8998 8916 SDM450 Stencil Template
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
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6in1 MSM8953 MSM8937 MSM8998 8916 SDM450 Stencil Template
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