N3710 SR2KL Stencil Template
Part Number intel CPU Stencil Manufacturer ATK
Stencil Template Direct heating Metal 304 Stainless steel
Package/Case 1 PCS Description Bulk new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
16 other products in the same category
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template 90x90
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U 8565U Stencil Template 90*90
BD82C604 SLJHV Stencil Template 90x90
BD82C604 SLJHV Stencil Template 90*90
i55257U SR26K Stencil Template 90x90
i5-5257U SR26K Stencil Template 90*90
i52415M SR071 Stencil Template 90x90
i5-2415M SR071 Stencil Template 90*90