Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
16 other products in the same category
BD82NM70 ALJTA Stencil Template 90x90
BD82NM70 ALJTA Stencil Template 90*90
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template 90x90
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template 90*90
i54210H SR1Q0 Stencil Template 90x90
i5-4210H SR1Q0 Stencil Template 90*90
i52467M SR0D6 Stencil Template 90x90
i5-2467M SR0D6 Stencil Template 90*90
i74650U SR16H Stencil Template 90x90
i7-4650U SR16H Stencil Template 90*90
47pcs Reball Stencils Universal Directly Heated Template
47pcs Reball Stencils Universal Directly Heated Template
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template