Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
16 other products in the same category
i74710HQ SR1PX Stencil Template 90x90
i7-4710HQ SR1PX Stencil Template 90*90
i56267U SR2JK Stencil Template 90x90
i5-6267U SR2JK Stencil Template 90*90
i72617M SR03T Stencil Template 90x90
i7-2617M SR03T Stencil Template 90*90
i58250U SR3LB Stencil Template 90x90
i5-8250U SR3LB Stencil Template 90*90
SONY PS3 D5305AFK RSX D5305F Stencil Template
SONY PS3 D5305AFK RSX D5305F Stencil Template
SAKTC1797 SAKTC1796 MPC5566 Stencil Template
SAK-TC1797 SAK-TC1796 MPC5566 Stencil Template