SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

€2.70
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SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

Chipsetpro.com

Chipsetpro.com

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Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

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CH000789

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SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template

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