Battery for HP Mini 2103000 DM1 108V 5200mAh PN HSTNNDB3B HSTNNYB3B MT03 MT06 MTO3 MTO6
Battery for HP Mini 210-3000, DM1 (10.8V 5200mAh) PN: HSTNN-DB3B HSTNN-YB3B MT03 MT06 MTO3 MTO6
25K Qwin 0.40mm BGA Leaded Solder Balls
Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin
BGA Alloy Sn63/Pb37 Date Code 19+
Package/Case 25K Description Original new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
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Battery for HP Mini 210-3000, DM1 (10.8V 5200mAh) PN: HSTNN-DB3B HSTNN-YB3B MT03 MT06 MTO3 MTO6
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