SEMS 18LF SAMSUNG

€7.94
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SEMS 18-LF SAMSUNG

Chipsetpro.com

Chipsetpro.com

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Delivery will take 14-28 days

SEMS 18-LF SAMSUNG

Part Number SEMS 18-LF Manufacturer SAMSUNG

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH003415

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SEMS 18LF SAMSUNG

SEMS 18-LF SAMSUNG

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