MSM8909-0VV QUALCOMM
Part Number MSM8909 Manufacturer QUALCOMM
BGA Alloy No Pb/Lead Free Date Code 16+
Package/Case 1 PCS Description Brand new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
16 other products in the same category
21 Models 1050pcs Triode SMD Common SOT23 package samples Kit
21 Models 1050pcs Triode SMD Common SOT-23 package samples Kit
338S00248 iphoneX audio codec ic u4700
338S00248 iphoneX audio codec ic - u4700