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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
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Samsung Exynos9810S9S9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000364
kr64.03

Samsung Exynos9810/S9/S9+ Stencil Template

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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
kr134.36 kr167.95

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
kr134.36 kr167.95

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

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FM880PAAY43KA Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000365
kr74.39

FM880PAAY43KA Stencil Template 90*90

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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
kr134.36 kr167.95

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

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ZM151032B1238 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000367
kr40.31

ZM151032B1238 Stencil Template

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G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
kr40.31

G86-603-A2 Stencil Template

  • -20%
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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54308U MGEQ2LLA

PO000025
kr134.36 kr167.95

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4308U MGEQ2LL/A

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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i7 I74578U BTOCTO

PO000026
kr134.36 kr167.95

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i7 I7-4578U BTO/CTO

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iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
kr42.68

iphone8 Stencil Template

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A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y31 MF855LLA

PO000027
kr134.36 kr167.95

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y31 MF855LL/A

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i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
kr40.83

i5-4200U SR170 Stencil Template

Samsung Exynos9810S9S9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000364
kr64.03

Samsung Exynos9810/S9/S9+ Stencil Template

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Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
kr134.36 kr167.95

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

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  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
kr134.36 kr167.95

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

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FM880PAAY43KA Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000365
kr74.39

FM880PAAY43KA Stencil Template 90*90

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Compare
  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
kr134.36 kr167.95

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

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Compare

ZM151032B1238 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000367
kr40.31

ZM151032B1238 Stencil Template

wishlist
Compare

G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
kr40.31

G86-603-A2 Stencil Template

wishlist
Compare
  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54308U MGEQ2LLA

PO000025
kr134.36 kr167.95

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4308U MGEQ2LL/A

wishlist
Compare
  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i7 I74578U BTOCTO

PO000026
kr134.36 kr167.95

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i7 I7-4578U BTO/CTO

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Compare

iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
kr42.68

iphone8 Stencil Template

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Compare
  • -20%

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y31 MF855LLA

PO000027
kr134.36 kr167.95

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y31 MF855LL/A

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Compare

i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
kr40.83

i5-4200U SR170 Stencil Template

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Compare
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