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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
  • Condition: New

BD82QM67 SLJ4M

BD82QM67 SLJ4M

Part Number BD82QM67 SLJ4M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000583
€32.80

BD82QM67 SLJ4M

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8600 MC270LLA

PO000011
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8600 MC270LL/A

QDFX2500MTHNA2

QDFX-2500MT-HN-A2

Part Number QDFX-2500MT-HN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000584
€36.10

QDFX-2500MT-HN-A2

Apple BIOS MBP12 2017 A1534 82000687 EMC2998

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001550
€44.38

Apple BIOS MBP12 2017 A1534 820-00687 EMC2998

N13EGEA2

N13E-GE-A2

Part Number N13E-GE-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1214

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000596
€74.67

N13E-GE-A2

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

2160683008 HD3650

216-0683008 HD3650

Part Number 216-0683008 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000613
€22.64

216-0683008 HD3650

Apple BIOS MBP13 2016 A1708 82000875 EMC2978

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001569
€37.05

Apple BIOS MBP13 2016 A1708 820-00875 EMC2978

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 MC438LLA

PO000013
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 MC438LL/A

BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
€45.95

BD82HM70 SJTNV

DC Power Jack Audio Board for Apple MacBook Air 13 A1466 2012 MD231 8203214A

Power Audio Board 820-3214-A for Apple MacBook Air 13" A1466 2012

Product Condition

NEW

Compatible Model

MacBook Air 13" A1466 2012

Compatible Subfamily

MacBook Air "Core i5" 1.8 13" (Mid-2012)

MacBook Air "Core i7" 2.0 13" (Mid-2012)

Compatible Model No

MD231LL/A

This Auction/Listing is for a Apple Macbook Air 13" A1466 2012 DC USB Jack Power Audio Board 820-3214-A

Item Condition: New

CH001597
€26.11

DC Power Jack Audio Board for Apple MacBook Air 13 A1466 2012 MD231 820-3214-A

BD82QM67 SLJ4M

BD82QM67 SLJ4M

Part Number BD82QM67 SLJ4M Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000583
€32.80

BD82QM67 SLJ4M

  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8600 MC270LLA

PO000011
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8600 MC270LL/A

QDFX2500MTHNA2

QDFX-2500MT-HN-A2

Part Number QDFX-2500MT-HN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000584
€36.10

QDFX-2500MT-HN-A2

Apple BIOS MBP12 2017 A1534 82000687 EMC2998

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001550
€44.38

Apple BIOS MBP12 2017 A1534 820-00687 EMC2998

N13EGEA2

N13E-GE-A2

Part Number N13E-GE-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1214

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000596
€74.67

N13E-GE-A2

  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

2160683008 HD3650

216-0683008 HD3650

Part Number 216-0683008 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000613
€22.64

216-0683008 HD3650

Apple BIOS MBP13 2016 A1708 82000875 EMC2978

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001569
€37.05

Apple BIOS MBP13 2016 A1708 820-00875 EMC2978

  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 MC438LLA

PO000013
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 MC438LL/A

BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
€45.95

BD82HM70 SJTNV

DC Power Jack Audio Board for Apple MacBook Air 13 A1466 2012 MD231 8203214A

Power Audio Board 820-3214-A for Apple MacBook Air 13" A1466 2012

Product Condition

NEW

Compatible Model

MacBook Air 13" A1466 2012

Compatible Subfamily

MacBook Air "Core i5" 1.8 13" (Mid-2012)

MacBook Air "Core i7" 2.0 13" (Mid-2012)

Compatible Model No

MD231LL/A

This Auction/Listing is for a Apple Macbook Air 13" A1466 2012 DC USB Jack Power Audio Board 820-3214-A

Item Condition: New

CH001597
€26.11

DC Power Jack Audio Board for Apple MacBook Air 13 A1466 2012 MD231 820-3214-A