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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
  • Categories: Laptop Parts, Repair tool
  • Condition: New

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

N13EGEA2

N13E-GE-A2

Part Number N13E-GE-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1214

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000596
€74.67

N13E-GE-A2

2160683008 HD3650

216-0683008 HD3650

Part Number 216-0683008 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000613
€22.64

216-0683008 HD3650

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 MC438LLA

PO000013
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 MC438LL/A

A1347 EMC 2442 Bios Chip EFI Firmware 820-2993 Mid2011 Core i5 I52415M MC815LLA

PO000014
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-2993 Mid-2011 Core i5 I5-2415M MC815LL/A

BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
€45.95

BD82HM70 SJTNV

PS100A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 30L

Login to Download: * Manual Download

Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.

CH000405
€375.45

PS-100A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 30L

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
€41.03

N11P-GS2-A2

  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

N13EGEA2

N13E-GE-A2

Part Number N13E-GE-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1214

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000596
€74.67

N13E-GE-A2

2160683008 HD3650

216-0683008 HD3650

Part Number 216-0683008 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000613
€22.64

216-0683008 HD3650

  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 MC438LLA

PO000013
€18.00 €22.50

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 MC438LL/A

  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-2993 Mid2011 Core i5 I52415M MC815LLA

PO000014
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-2993 Mid-2011 Core i5 I5-2415M MC815LL/A

BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
€45.95

BD82HM70 SJTNV

PS100A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 30L

Login to Download: * Manual Download

Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.

CH000405
€375.45

PS-100A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 30L

  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
€18.00 €22.50

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
€41.03

N11P-GS2-A2