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  • Categories: Bios Chip Programming
  • Categories: Other BGA Chips & ICs
  • Categories: Pin Holder
  • Categories: Programmer
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ITE IT8517VG HX0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
zl14.69

ITE IT8517VG HX0

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3227 Late 2012 Core i5 I53210M MD387LLA

PO000018
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3227 Late 2012 Core i5 I5-3210M MD387LL/A

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RICHTEK RT8152A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
zl14.69

RICHTEK RT8152A

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD388LLA

PO000019
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD388LL/A

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TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
zl14.69

TI TPS51125A

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000020
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

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NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
zl14.69

NEC 2R5102

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

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apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
zl33.82

apple 338S1077

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TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
zl14.69

TI BQ2084

  • -20%
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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
zl76.64 zl95.79

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

ITE IT8517VG HX0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000374
zl14.69

ITE IT8517VG HX0

wishlist
Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3227 Late 2012 Core i5 I53210M MD387LLA

PO000018
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3227 Late 2012 Core i5 I5-3210M MD387LL/A

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Compare

RICHTEK RT8152A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000375
zl14.69

RICHTEK RT8152A

wishlist
Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD388LLA

PO000019
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD388LL/A

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TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
zl14.69

TI TPS51125A

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Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000020
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

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NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
zl14.69

NEC 2R5102

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Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

wishlist
Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
zl76.64 zl95.79

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

wishlist
Compare

apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
zl33.82

apple 338S1077

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Compare

TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
zl14.69

TI BQ2084

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Compare
  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
zl76.64 zl95.79

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

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