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  • Categories: Adapter, DC cable
  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
zl195.72

BD82HM70 SJTNV

  • -20%
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A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
zl76.67 zl95.84

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

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N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
zl174.75

N11P-GS2-A2

  • -20%
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A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
zl76.67 zl95.84

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

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SR2KL N3710

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000639
zl244.65

SR2KL N3710

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GFGO7200TNA3

GF-GO7200T-N-A3

Part Number GF-GO7200T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000644
zl136.30

GF-GO7200T-N-A3

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AC Adapter Cable UK AU US EU

Description:

Can be universally used with a wide variety of electronic devices including

laptop computers, ac adapters, digital cameras, camcorders, monitors, printers,

Direct TV and more!

Features:

Compatible with: laptop computers, ac adapters, digital cameras, camcorders, monitors, printers.

Interface: EU /US /AU/ UK Standard Plug

Color: Black

Cable length: 1.2m

Input:10A 240V AC

Convenience and easy to use for your laptop computers.

Package include:

1 X Power Supply Adapter

CH003893
zl15.83

AC Adapter Cable UK AU US EU

  • -20%
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A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
zl76.67 zl95.84

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

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G84751A2 8700MGT

G84-751-A2 8700MGT

Part Number G84-751-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000660
zl209.70

G84-751-A2 8700MGT

BD82HM70 SJTNV

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000615
zl195.72

BD82HM70 SJTNV

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  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
zl76.67 zl95.84

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

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Power Supply ASUS 19V 474A 90W 5525

Power Supply ASUS 19V 4.74A 90W 5.5*2.5

Input Voltage Range AC 100V - 240V Output DC 19V 4.74A

Connector Size 5.5mm*2.5mm Power 90W

AC Cable Include AC Cable Description New

CH003790
zl47.66

Power Supply ASUS 19V 4.74A 90W 5.5*2.5

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N11PGS2A2

N11P-GS2-A2

Part Number N11P-GS2-A2 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000623
zl174.75

N11P-GS2-A2

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  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
zl76.67 zl95.84

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

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SR2KL N3710

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000639
zl244.65

SR2KL N3710

wishlist
Compare

GFGO7200TNA3

GF-GO7200T-N-A3

Part Number GF-GO7200T-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000644
zl136.30

GF-GO7200T-N-A3

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Compare

AC Adapter Cable UK AU US EU

Description:

Can be universally used with a wide variety of electronic devices including

laptop computers, ac adapters, digital cameras, camcorders, monitors, printers,

Direct TV and more!

Features:

Compatible with: laptop computers, ac adapters, digital cameras, camcorders, monitors, printers.

Interface: EU /US /AU/ UK Standard Plug

Color: Black

Cable length: 1.2m

Input:10A 240V AC

Convenience and easy to use for your laptop computers.

Package include:

1 X Power Supply Adapter

CH003893
zl15.83

AC Adapter Cable UK AU US EU

wishlist
Compare
  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3017 Mid2011 Core i7 I72635QM MC936LLA

PO000017
zl76.67 zl95.84

A1347 EMC 2442 Bios EFI Firmware 820-3017 Mid-2011 Core i7 I7-2635QM MC936LL/A

wishlist
Compare

G84751A2 8700MGT

G84-751-A2 8700MGT

Part Number G84-751-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1215

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000660
zl209.70

G84-751-A2 8700MGT

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Compare
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