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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
  • Categories: Pin Holder
  • Availability: In stock
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N10MGS2SA2 G210M

N10M-GS2-S-A2 G210M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1116

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000778
kr225.01

N10M-GS2-S-A2 G210M

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2160683013 HD3650

216-0683013 HD3650

Part Number 216-0683013 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0926

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000783
kr213.54

216-0683013 HD3650

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
kr200.66 kr250.83

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
kr200.66 kr250.83

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

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GFGO7300NA3

GF-GO7300-N-A3

Part Number GF-GO7300-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000792
kr274.41

GF-GO7300-N-A3

  • -20%
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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m7 M76Y75 BTOCTO

PO000032
kr200.66 kr250.83

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m7 M7-6Y75 BTO/CTO

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G86630A2 8400MGS

G86-630-A2 8400MGS

Part Number G86-630-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1246

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000796
kr179.28

G86-630-A2 8400MGS

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N12PNS1SA1

N12P-NS1-S-A1

Part Number N12P-NS1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000799
kr274.41

N12P-NS1-S-A1

  • -20%
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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core m3 M37Y32 MNYF2LLA

PO000033
kr200.66 kr250.83

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core m3 M3-7Y32 MNYF2LL/A

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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
kr200.66 kr250.83

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

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DH82HM87 SR13H

DH82HM87 SR13H

Part Number DH82HM87 SR13H Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000815
kr393.33

DH82HM87 SR13H

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N11PGS1A2 G330M

N11P-GS1-A2 G330M

Part Number N11P-GS1-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000825
kr438.87

N11P-GS1-A2 G330M

N10MGS2SA2 G210M

N10M-GS2-S-A2 G210M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1116

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000778
kr225.01

N10M-GS2-S-A2 G210M

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2160683013 HD3650

216-0683013 HD3650

Part Number 216-0683013 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 0926

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000783
kr213.54

216-0683013 HD3650

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A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m3 M36Y30 MLHA2LLA

PO000030
kr200.66 kr250.83

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m3 M3-6Y30 MLHA2LL/A

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  • -20%

A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m5 M56Y54 MLHC2LLA

PO000031
kr200.66 kr250.83

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m5 M5-6Y54 MLHC2LL/A

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GFGO7300NA3

GF-GO7300-N-A3

Part Number GF-GO7300-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000792
kr274.41

GF-GO7300-N-A3

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  • -20%

A1534 EMC 2991 Bios Chip EFI Firmware 820-00244 Early 2016 Core m7 M76Y75 BTOCTO

PO000032
kr200.66 kr250.83

A1534 EMC 2991 Bios EFI Firmware 820-00244 Early 2016 Core m7 M7-6Y75 BTO/CTO

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G86630A2 8400MGS

G86-630-A2 8400MGS

Part Number G86-630-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1246

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000796
kr179.28

G86-630-A2 8400MGS

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N12PNS1SA1

N12P-NS1-S-A1

Part Number N12P-NS1-S-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000799
kr274.41

N12P-NS1-S-A1

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  • -20%

A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core m3 M37Y32 MNYF2LLA

PO000033
kr200.66 kr250.83

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core m3 M3-7Y32 MNYF2LL/A

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  • -20%

A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
kr200.66 kr250.83

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

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DH82HM87 SR13H

DH82HM87 SR13H

Part Number DH82HM87 SR13H Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000815
kr393.33

DH82HM87 SR13H

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N11PGS1A2 G330M

N11P-GS1-A2 G330M

Part Number N11P-GS1-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1023

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000825
kr438.87

N11P-GS1-A2 G330M

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