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  • Condition: New

N11MGE1BA3 G210M

N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000836
€19.69

N11M-GE1-B-A3 G210M

A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9400 MC233LLA

PO000040
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9400 MC233LL/A

N16SGTSA2

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000837
€25.93

N16S-GT-S-A2

3.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000585
€7.83

3.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9600 MC234LLA

PO000041
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9600 MC234LL/A

A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LLA

PO000042
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LL/A

HAYEAR 4K industrial camera microscope SONY IMX377 digital microscope HDMI USB mikroskop kamera

Login to Download: Download software User Manual

This is UltraHD 4K industrial camera. Resolution is 7440 x 5580 pixels. With standard HDMI and USB interface.

It can be used for education, scientific research, laboratory, demonstration, maintenance and inspection.

Feature:

Model: HY-5099

Effective Pixels: SONY IMX CMOS 1/2.3 4K SENSOR

Resolution: 4K/2K/1080P 1080P(USB)

Sensor Size: 1/2.3inch

Pixel Size: 1.55 1.55m

Image Resolution: 4608 X 3456 (16MP)

Image Format: JPEG

Lens Type: C / CS

Frame Fate: 3840 x 2160@30FPS(4K); 1080P 120@FPS; 720P 240@FPS

Output: HDMI/USB

Storage: TF Card, Max 128G

PC Support: Windows XP/7/8/10 , PC Software with Measuring Function

Image Scaling: 8-Fold zoom

Image Measurement: Support HAYEAR Measurement Software

Support Language: English/ French/ Spanish/ Portugues/ Deutsch/ Italiano/ Chinese/ Russian/ Japanese

Camera Size: 636258 mm

Package Size: 16108 cm

Package weight: 0.5Kg

Package list:

1 x 4K Microscope Camera

1 x Power supply

1 x HDMI cable

1 x USB cable

1 x Software DISC

1 x Remote Control

CH000593
€197.67

HAYEAR 4K industrial camera microscope SONY IMX377 digital microscope HDMI USB mikroskop kamera

N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LLA

PO000043
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LL/A

G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega256016AU Board For Arduino TFG

Mega 2560 R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

Description:

Manufactured By Good supplier

Microcontroller: ATmega2560.Operating Voltage 5V.Input Voltage (recommended) 7-12V.

Input Voltage (limits) 6-20V.Digital I/O Pins 54 (of which 14 provide PWM output).

Analog Input Pins 16.DC Current per I/O Pin 40 mA.

DC Current for 3.3V Pin 50 mA.Flash Memory 256 KB of which 8 KB used by bootloader.SRAM 8 KB.

EEPROM 4 KB.Clock Speed 16 MHz.

Package included:

1xWireless R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

CH000598
€12.00

Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino TFG

N14MGLBA2

N14M-GL-B-A2

Part Number N14M-GL-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1320

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000871
€25.93

N14M-GL-B-A2

N11MGE1BA3 G210M

N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000836
€19.69

N11M-GE1-B-A3 G210M

  • -20%

A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9400 MC233LLA

PO000040
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9400 MC233LL/A

N16SGTSA2

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000837
€25.93

N16S-GT-S-A2

3.0m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000585
€7.83

3.0m OMEGA K-TYPE Thermocouple TT-K-30-SLE

  • -20%

A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9600 MC234LLA

PO000041
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9600 MC234LL/A

  • -20%

A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LLA

PO000042
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LL/A

HAYEAR 4K industrial camera microscope SONY IMX377 digital microscope HDMI USB mikroskop kamera

Login to Download: Download software User Manual

This is UltraHD 4K industrial camera. Resolution is 7440 x 5580 pixels. With standard HDMI and USB interface.

It can be used for education, scientific research, laboratory, demonstration, maintenance and inspection.

Feature:

Model: HY-5099

Effective Pixels: SONY IMX CMOS 1/2.3 4K SENSOR

Resolution: 4K/2K/1080P 1080P(USB)

Sensor Size: 1/2.3inch

Pixel Size: 1.55 1.55m

Image Resolution: 4608 X 3456 (16MP)

Image Format: JPEG

Lens Type: C / CS

Frame Fate: 3840 x 2160@30FPS(4K); 1080P 120@FPS; 720P 240@FPS

Output: HDMI/USB

Storage: TF Card, Max 128G

PC Support: Windows XP/7/8/10 , PC Software with Measuring Function

Image Scaling: 8-Fold zoom

Image Measurement: Support HAYEAR Measurement Software

Support Language: English/ French/ Spanish/ Portugues/ Deutsch/ Italiano/ Chinese/ Russian/ Japanese

Camera Size: 636258 mm

Package Size: 16108 cm

Package weight: 0.5Kg

Package list:

1 x 4K Microscope Camera

1 x Power supply

1 x HDMI cable

1 x USB cable

1 x Software DISC

1 x Remote Control

CH000593
€197.67

HAYEAR 4K industrial camera microscope SONY IMX377 digital microscope HDMI USB mikroskop kamera

N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

  • -20%

A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LLA

PO000043
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LL/A

G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega256016AU Board For Arduino TFG

Mega 2560 R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

Description:

Manufactured By Good supplier

Microcontroller: ATmega2560.Operating Voltage 5V.Input Voltage (recommended) 7-12V.

Input Voltage (limits) 6-20V.Digital I/O Pins 54 (of which 14 provide PWM output).

Analog Input Pins 16.DC Current per I/O Pin 40 mA.

DC Current for 3.3V Pin 50 mA.Flash Memory 256 KB of which 8 KB used by bootloader.SRAM 8 KB.

EEPROM 4 KB.Clock Speed 16 MHz.

Package included:

1xWireless R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

CH000598
€12.00

Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino TFG

N14MGLBA2

N14M-GL-B-A2

Part Number N14M-GL-B-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1320

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000871
€25.93

N14M-GL-B-A2