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  • Categories: CPU and Graphic Chips
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GL82HM175 SR30W

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000227
zl244.36

GL82HM175 SR30W

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EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 3264bit and Adapter Socket

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include:

1* EZP2013 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH000249
zl93.62

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 32/64bit and Adapter Socket

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N16EGTA1 GTX970M

N16E-GT-A1 GTX970M

Part Number N16E-GT-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 105 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000229
zl670.23

N16E-GT-A1 GTX970M

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2160856040

216-0856040

Part Number 216-0856040 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2009

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000233
zl88.90

216-0856040

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SR2EU i36100U

SR2EU i3-6100U

Part Number Core i3-6100U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000252
zl767.97

SR2EU i3-6100U

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2160707001 HD3470

216-0707001 HD3470

Part Number 216-0707001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1004

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000269
zl70.38

216-0707001 HD3470

GL82HM175 SR30W

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000227
zl244.36

GL82HM175 SR30W

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EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 3264bit and Adapter Socket

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include:

1* EZP2013 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH000249
zl93.62

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 32/64bit and Adapter Socket

wishlist
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N16EGTA1 GTX970M

N16E-GT-A1 GTX970M

Part Number N16E-GT-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 105 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000229
zl670.23

N16E-GT-A1 GTX970M

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Compare

2160856040

216-0856040

Part Number 216-0856040 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2009

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000233
zl88.90

216-0856040

wishlist
Compare

SR2EU i36100U

SR2EU i3-6100U

Part Number Core i3-6100U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000252
zl767.97

SR2EU i3-6100U

wishlist
Compare

2160707001 HD3470

216-0707001 HD3470

Part Number 216-0707001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1004

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000269
zl70.38

216-0707001 HD3470

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Compare
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