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  • Categories: Adapter, DC cable
  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i7 I76660U BTOCTO

PO000101
zl76.64 zl95.79

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i7 I7-6660U BTO/CTO

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G84750A2 8700MGT 64bit 128MB

G84-750-A2 8700MGT 64bit 128MB

Part Number G84-750-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1323

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001478
zl74.06

G84-750-A2 8700MGT 64bit 128MB

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2160810005 HD6750

216-0810005 HD6750

Part Number 216-0810005 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001487
zl259.49

216-0810005 HD6750

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A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i5 I56287U BTOCTO

PO000103
zl76.64 zl95.79

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i5 I5-6287U BTO/CTO

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SR240 i35020U

SR240 i3-5020U

Part Number SR240 i3-5020U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001488
zl405.23

SR240 i3-5020U

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A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i7 I76567U BTOCTO

PO000104
zl76.64 zl95.79

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i7 I7-6567U BTO/CTO

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SR348 4415U

4415U SR348 Pentium Dual-Core Mobile FJ8067702739932

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001493
zl384.27

SR348 4415U

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A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i5 I57360U MPXQ2LLA

PO000105
zl76.64 zl95.79

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i5 I5-7360U MPXQ2LL/A

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SR2EY i56200U

SR2EY i5-6200U

Part Number i5-6200U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001497
zl978.13

SR2EY i5-6200U

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AM5545HE44HL A85545M

AM5545HE44HL A8-5545M

Part Number AM5545HE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

AM5545HE44HL A8-5545M Processor for Laptop AMD A-Series BGA827 1.7 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001503
zl196.47

AM5545HE44HL A8-5545M

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A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i7 I77660U BTOCTO

PO000106
zl76.64 zl95.79

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i7 I7-7660U BTO/CTO

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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57267U MPXV2LLA

PO000107
zl76.64 zl95.79

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7267U MPXV2LL/A

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A1708 EMC 2978 Bios Chip EFI Firmware 820-00875 Late 2016 13 Core i7 I76660U BTOCTO

PO000101
zl76.64 zl95.79

A1708 EMC 2978 Bios EFI Firmware 820-00875 Late 2016 13 Core i7 I7-6660U BTO/CTO

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G84750A2 8700MGT 64bit 128MB

G84-750-A2 8700MGT 64bit 128MB

Part Number G84-750-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1323

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001478
zl74.06

G84-750-A2 8700MGT 64bit 128MB

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2160810005 HD6750

216-0810005 HD6750

Part Number 216-0810005 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001487
zl259.49

216-0810005 HD6750

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A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i5 I56287U BTOCTO

PO000103
zl76.64 zl95.79

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i5 I5-6287U BTO/CTO

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SR240 i35020U

SR240 i3-5020U

Part Number SR240 i3-5020U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001488
zl405.23

SR240 i3-5020U

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A1706 EMC 3071 Bios Chip EFI Firmware 820-00239 Late 2016 13 Core i7 I76567U BTOCTO

PO000104
zl76.64 zl95.79

A1706 EMC 3071 Bios EFI Firmware 820-00239 Late 2016 13 Core i7 I7-6567U BTO/CTO

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SR348 4415U

4415U SR348 Pentium Dual-Core Mobile FJ8067702739932

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001493
zl384.27

SR348 4415U

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A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i5 I57360U MPXQ2LLA

PO000105
zl76.64 zl95.79

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i5 I5-7360U MPXQ2LL/A

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SR2EY i56200U

SR2EY i5-6200U

Part Number i5-6200U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001497
zl978.13

SR2EY i5-6200U

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AM5545HE44HL A85545M

AM5545HE44HL A8-5545M

Part Number AM5545HE44HL Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

AM5545HE44HL A8-5545M Processor for Laptop AMD A-Series BGA827 1.7 GHz CPU 4 cores

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001503
zl196.47

AM5545HE44HL A8-5545M

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A1708 EMC 3164 Bios Chip EFI Firmware 820-00840 Mid2017 13 Core i7 I77660U BTOCTO

PO000106
zl76.64 zl95.79

A1708 EMC 3164 Bios EFI Firmware 820-00840 Mid-2017 13 Core i7 I7-7660U BTO/CTO

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Compare
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A1706 EMC 3163 Bios Chip EFI Firmware 820-00923 Mid2017 13 Core i5 I57267U MPXV2LLA

PO000107
zl76.64 zl95.79

A1706 EMC 3163 Bios EFI Firmware 820-00923 Mid-2017 13 Core i5 I5-7267U MPXV2LL/A

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