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EFI SPI SAM WSON ROM Debug Connector Flash Service Bypass J6100

Product description:

This item will enable you to have accurate reads/writes SPI Flash Memory used in MacBook models.

 The following be supported: 

 A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1370 820-2855-A, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

 

In package:

 1pcs x EFI Ribbon cable

1pcs x QFN WSON Socket 6x5

1pcs x QFN WSON Socket 6x8

 

Extra Information:

Details about EFI Ribbon Cable: https://www.ebay.com/itm/133187974519

Details about WSON QFN 6x5: https://www.ebay.com/itm/133798227558

Details about WSON QFN 8x6: https://www.ebay.com/itm/133798207555

 

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Warranty

This product will have a 30-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000043
€78.00

 

In package:

 1pcs x EFI Ribbon cable

1pcs x QFN WSON Socket 6x5

1pcs x QFN WSON Socket 6x8

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Winbond WPCE776SA0DG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000223
€6.35

Winbond WPCE776SA0DG

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Intersil ISL6261

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000232
€3.45

Intersil ISL6261

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ASMEDIA ASM1042

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000234
€3.45

ASMEDIA ASM1042

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RICHTEK RT8209B A0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000238
€3.45

RICHTEK RT8209B (A0=)

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ENE KB3926QF D2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000243
€3.45

ENE KB3926QF D2

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BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

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IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

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Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

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Intersil ISL95870A UTQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000272
€3.45

Intersil ISL95870A UTQFN

  • New

EFI SPI SAM WSON ROM Debug Connector Flash Service Bypass J6100

Product description:

This item will enable you to have accurate reads/writes SPI Flash Memory used in MacBook models.

 The following be supported: 

 A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1370 820-2855-A, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

 

In package:

 1pcs x EFI Ribbon cable

1pcs x QFN WSON Socket 6x5

1pcs x QFN WSON Socket 6x8

 

Extra Information:

Details about EFI Ribbon Cable: https://www.ebay.com/itm/133187974519

Details about WSON QFN 6x5: https://www.ebay.com/itm/133798227558

Details about WSON QFN 8x6: https://www.ebay.com/itm/133798207555

 

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Warranty

This product will have a 30-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000043
€78.00

 

In package:

 1pcs x EFI Ribbon cable

1pcs x QFN WSON Socket 6x5

1pcs x QFN WSON Socket 6x8

wishlist
Compare

Winbond WPCE776SA0DG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000223
€6.35

Winbond WPCE776SA0DG

wishlist
Compare

Intersil ISL6261

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000232
€3.45

Intersil ISL6261

wishlist
Compare

ASMEDIA ASM1042

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000234
€3.45

ASMEDIA ASM1042

wishlist
Compare

RICHTEK RT8209B A0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000238
€3.45

RICHTEK RT8209B (A0=)

wishlist
Compare

ENE KB3926QF D2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000243
€3.45

ENE KB3926QF D2

wishlist
Compare

BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

wishlist
Compare

TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

wishlist
Compare

IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

wishlist
Compare

Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

wishlist
Compare

Intersil ISL95870A UTQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000272
€3.45

Intersil ISL95870A UTQFN

wishlist
Compare
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