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SPI SAM EFI Ribbon Cable ROM Debug Connector Tool for Macbook

In package:

1 pcs   x  EFI Ribbon Cable

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Product description:

Modify, and upgrade your MacBook effortlessly with our Professional BIOS Flashing Set. Perfect for MacBook, MacBook Air, and MacBook Pro models from 2010 to 2017, this set allows manual in bios bin file settings adjustments for ME region, iCloud, and BIOS passw clearing. No de-soldering required.

 

Compatible Mcbooks with SVOD, RT809H/F:

A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

CH341 supported:

MBA11 2015 A1465 820-00164

MBA11 2013 A1465 820-3435

MBA13 2011 A1369 820-3023

MBA11 2011 A1370 820-3024

MBA 13 2013 A1466 820-3437

MBA 13 2012 A1466 820-3209

MBA13 2015 A1466 820-00165

MBA13 2017 A1466 820-00165

2016 A1708 820-00875 MBP13

MBP13 2016 A1706 820-00239

MBP15 2017 A1707 820-00928

MBP15 2016 A1707 820-00281

MBP13 2017 A1706 820-00923

MBP13 2017 A1708 820-00840

MBP13 2015 A1502 820-4924

MBP13 2014 A1502 820-3476

MBP13 2014 A1502 820-3536 

MBP13 2013 A1502 820-3476

MBP13 2014 A1502 820-3476

MBP15 2012 A1398 820-3332

MBP15 2013 A1398 820-3332

MBP15 2013 A1398 820-3662

MBP15 2013 A1398 820-3787

MBP15 2014 A1398 820-3662

MBP15 2015 A1398 820-00138 

MBP15 2015 A1398 820-00163

MBP12 2015 A1534 820-00045

MBP12 2016 A1534 820-00244

MacMini 2011 A1347 820-2993

  

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000001
€45.00

In package:

1 pcs   x  EFI Ribbon Cable
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Intersil ISL6261

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000232
€3.45

Intersil ISL6261

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ASMEDIA ASM1042

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000234
€3.45

ASMEDIA ASM1042

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RICHTEK RT8209B A0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000238
€3.45

RICHTEK RT8209B (A0=)

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ENE KB3926QF D2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000243
€3.45

ENE KB3926QF D2

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BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

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IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

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Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

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Intersil ISL95870A UTQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000272
€3.45

Intersil ISL95870A UTQFN

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NUVOTON NPCE794LAODX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000273
€3.97

NUVOTON NPCE794LAODX

  • New

SPI SAM EFI Ribbon Cable ROM Debug Connector Tool for Macbook

In package:

1 pcs   x  EFI Ribbon Cable

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Product description:

Modify, and upgrade your MacBook effortlessly with our Professional BIOS Flashing Set. Perfect for MacBook, MacBook Air, and MacBook Pro models from 2010 to 2017, this set allows manual in bios bin file settings adjustments for ME region, iCloud, and BIOS passw clearing. No de-soldering required.

 

Compatible Mcbooks with SVOD, RT809H/F:

A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

CH341 supported:

MBA11 2015 A1465 820-00164

MBA11 2013 A1465 820-3435

MBA13 2011 A1369 820-3023

MBA11 2011 A1370 820-3024

MBA 13 2013 A1466 820-3437

MBA 13 2012 A1466 820-3209

MBA13 2015 A1466 820-00165

MBA13 2017 A1466 820-00165

2016 A1708 820-00875 MBP13

MBP13 2016 A1706 820-00239

MBP15 2017 A1707 820-00928

MBP15 2016 A1707 820-00281

MBP13 2017 A1706 820-00923

MBP13 2017 A1708 820-00840

MBP13 2015 A1502 820-4924

MBP13 2014 A1502 820-3476

MBP13 2014 A1502 820-3536 

MBP13 2013 A1502 820-3476

MBP13 2014 A1502 820-3476

MBP15 2012 A1398 820-3332

MBP15 2013 A1398 820-3332

MBP15 2013 A1398 820-3662

MBP15 2013 A1398 820-3787

MBP15 2014 A1398 820-3662

MBP15 2015 A1398 820-00138 

MBP15 2015 A1398 820-00163

MBP12 2015 A1534 820-00045

MBP12 2016 A1534 820-00244

MacMini 2011 A1347 820-2993

  

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000001
€45.00

In package:

1 pcs   x  EFI Ribbon Cable
wishlist
Compare

Intersil ISL6261

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000232
€3.45

Intersil ISL6261

wishlist
Compare

ASMEDIA ASM1042

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000234
€3.45

ASMEDIA ASM1042

wishlist
Compare

RICHTEK RT8209B A0

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000238
€3.45

RICHTEK RT8209B (A0=)

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Compare

ENE KB3926QF D2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000243
€3.45

ENE KB3926QF D2

wishlist
Compare

BROADCOM BCM5882B0KFBG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000247
€7.94

BROADCOM BCM5882B0KFBG

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Compare

TI TPS2546

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000250
€3.45

TI TPS2546

wishlist
Compare

IRF6725MTRPBFGPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000253
€3.45

IRF6725MTRPBF-GP-U

wishlist
Compare

Intersil ISL95833HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000263
€3.45

Intersil ISL95833HRTZ

wishlist
Compare

Intersil ISL95870A UTQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000272
€3.45

Intersil ISL95870A UTQFN

wishlist
Compare

NUVOTON NPCE794LAODX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000273
€3.97

NUVOTON NPCE794LAODX

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Compare
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