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N12PGV2A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000954
€5.40

N12P-GV2-A1 Stencil Template

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T2 ROM EFI Bluetooth WiFi A1932 A1989 A1990 A2141 A2159 A2179 A2251 A2289

Product description:

Adapter T2 ROM XSON Wifi BT ROM SOP8 WSON Wlcsp BGA12 Wlcsp BGA16

 This specialized PCB offering seamless accessibility to extract information from SPI Flash Memory packages used for EFI and T2 Rom's. Can be read the following:

  • T2 ROM;
  • SPI Flash Memory (EFI);
  • Bluetooth/WiFi SPI Flash Memory;
  • USB SPI Flash Memory;
  • GPU SPI Flash Memory.

In package:

1 pcs x BLACK PCB ADAPTER

Greater support are provided with this adapter:

  • SOP-8
  • USON-8 3x2 
  • USON-8 4x3
  • WSON-8 6x5
  • WSON-8 8x6
  • XSON-8
  • WLCSP BGA12
  • WLCSP BGA16

 

MacBook T2 ROM Support
Model # Board # MacBook Series
a2289 820-01987 MacBook Pro (13-inch, 2020)
a2251 820-01949 MacBook Pro (13-inch, 2020 )
a2179 820-01958 MacBook Air (Retina, 13-inch, 2020)
a2159 820-01598 MacBook Pro (13-inch, 2019 )
a2141 820-01700 MacBook Pro (16-inch, 2019)
a1990 820-01041 MacBook Pro (15-inch, 2018 , 2019)
a1989 820-00850 MacBook Pro (13-inch, 2018 , 2019)
a1932 820-01521 MacBook Air (Retina, 13-inch, 2018 , 2019)

 

Product description:

SVOD4 , SVOD3 , RT809F+1.8V adapter, RT809H, Xeltek , TNM , CH341A.v1.7+with 1.8V power output


 Shipping time

Please to select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited: 5-10 working days  (Europe and Worldwide)

 

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax !!!

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000165
€16.53

Adapter T2 ROM Xson Wifi BT ROM SOP8 WSON Wlcsp

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N2930 SR1W3 Stencil Template

N2930 SR1W3 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000956
€6.22

N2930 SR1W3 Stencil Template

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i53210M SR0N0 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000958
€5.40

i5-3210M SR0N0 Stencil Template

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SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000965
€5.40

SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

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i56287U SR2JJ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000973
€9.97

i5-6287U SR2JJ Stencil Template 90*90

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LGE35230 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000983
€9.97

LGE35230 Stencil Template 90*90

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GL82Q150 SR2C6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000986
€4.35

GL82Q150 SR2C6 Stencil Template

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2160856040 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000990
€5.40

216-0856040 Stencil Template

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i73517U SR0N6 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001002
€9.97

i7-3517U SR0N6 Stencil Template 90*90

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2160810005 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001006
€9.97

216-0810005 Stencil Template 90*90

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218S4RBSA11G Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001009
€5.40

218S4RBSA11G Stencil Template

N12PGV2A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000954
€5.40

N12P-GV2-A1 Stencil Template

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Compare

T2 ROM EFI Bluetooth WiFi A1932 A1989 A1990 A2141 A2159 A2179 A2251 A2289

Product description:

Adapter T2 ROM XSON Wifi BT ROM SOP8 WSON Wlcsp BGA12 Wlcsp BGA16

 This specialized PCB offering seamless accessibility to extract information from SPI Flash Memory packages used for EFI and T2 Rom's. Can be read the following:

  • T2 ROM;
  • SPI Flash Memory (EFI);
  • Bluetooth/WiFi SPI Flash Memory;
  • USB SPI Flash Memory;
  • GPU SPI Flash Memory.

In package:

1 pcs x BLACK PCB ADAPTER

Greater support are provided with this adapter:

  • SOP-8
  • USON-8 3x2 
  • USON-8 4x3
  • WSON-8 6x5
  • WSON-8 8x6
  • XSON-8
  • WLCSP BGA12
  • WLCSP BGA16

 

MacBook T2 ROM Support
Model # Board # MacBook Series
a2289 820-01987 MacBook Pro (13-inch, 2020)
a2251 820-01949 MacBook Pro (13-inch, 2020 )
a2179 820-01958 MacBook Air (Retina, 13-inch, 2020)
a2159 820-01598 MacBook Pro (13-inch, 2019 )
a2141 820-01700 MacBook Pro (16-inch, 2019)
a1990 820-01041 MacBook Pro (15-inch, 2018 , 2019)
a1989 820-00850 MacBook Pro (13-inch, 2018 , 2019)
a1932 820-01521 MacBook Air (Retina, 13-inch, 2018 , 2019)

 

Product description:

SVOD4 , SVOD3 , RT809F+1.8V adapter, RT809H, Xeltek , TNM , CH341A.v1.7+with 1.8V power output


 Shipping time

Please to select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited: 5-10 working days  (Europe and Worldwide)

 

Warranty

This product will have a 90-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax !!!

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Canada, Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000165
€16.53

Adapter T2 ROM Xson Wifi BT ROM SOP8 WSON Wlcsp

wishlist
Compare

N2930 SR1W3 Stencil Template

N2930 SR1W3 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000956
€6.22

N2930 SR1W3 Stencil Template

wishlist
Compare

i53210M SR0N0 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000958
€5.40

i5-3210M SR0N0 Stencil Template

wishlist
Compare

SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000965
€5.40

SR177 SR1JJ SR173 SR175 SR176 SR178 SR179 Stencil Template

wishlist
Compare

i56287U SR2JJ Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000973
€9.97

i5-6287U SR2JJ Stencil Template 90*90

wishlist
Compare

LGE35230 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000983
€9.97

LGE35230 Stencil Template 90*90

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Compare

GL82Q150 SR2C6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000986
€4.35

GL82Q150 SR2C6 Stencil Template

wishlist
Compare

2160856040 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000990
€5.40

216-0856040 Stencil Template

wishlist
Compare

i73517U SR0N6 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001002
€9.97

i7-3517U SR0N6 Stencil Template 90*90

wishlist
Compare

2160810005 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001006
€9.97

216-0810005 Stencil Template 90*90

wishlist
Compare

218S4RBSA11G Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001009
€5.40

218S4RBSA11G Stencil Template

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Compare
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