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2160772003 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000299
zl22.97

216-0772003 Stencil Template

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A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P7550 MC238LLA

PO000007
zl76.58 zl95.72

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P7550 MC238LL/A

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i76700HQ SR2FQ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000304
zl29.09

i7-6700HQ SR2FQ Stencil Template

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A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC239LLA

PO000008
zl76.58 zl95.72

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC239LL/A

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GK104225A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000306
zl31.74

GK104-225-A2 Stencil Template

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A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8800 BTOCTO

PO000009
zl76.58 zl95.72

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8800 BTO/CTO

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A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC408LLA

PO000010
zl76.58 zl95.72

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC408LL/A

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A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8600 MC270LLA

PO000011
zl76.58 zl95.72

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8600 MC270LL/A

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2160810084 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000309
zl42.40

216-0810084 Stencil Template 90*90

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2150839039 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000312
zl22.97

215-0839039 Stencil Template

  • -20%
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A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
zl76.58 zl95.72

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

2160772003 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000299
zl22.97

216-0772003 Stencil Template

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A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P7550 MC238LLA

PO000007
zl76.58 zl95.72

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P7550 MC238LL/A

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i76700HQ SR2FQ Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000304
zl29.09

i7-6700HQ SR2FQ Stencil Template

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Compare
  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC239LLA

PO000008
zl76.58 zl95.72

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC239LL/A

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GK104225A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000306
zl31.74

GK104-225-A2 Stencil Template

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  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8800 BTOCTO

PO000009
zl76.58 zl95.72

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8800 BTO/CTO

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  • -20%

A1283 EMC 2336 Bios Chip EFI Firmware Late 2009 Core 2 Duo P8700 MC408LLA

PO000010
zl76.58 zl95.72

A1283 EMC 2336 Bios EFI Firmware Late 2009 Core 2 Duo P8700 MC408LL/A

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A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8600 MC270LLA

PO000011
zl76.58 zl95.72

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8600 MC270LL/A

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2160810084 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000309
zl42.40

216-0810084 Stencil Template 90*90

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Compare

2150839039 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000312
zl22.97

215-0839039 Stencil Template

wishlist
Compare
  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
zl76.58 zl95.72

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

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Compare
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