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  • Categories: BGA Reballing Kits, Stencils
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD388LLA

PO000019
$21.00 $26.25

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD388LL/A

GK106220A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
$7.54

GK106-220-A1 Stencil Template

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000020
$21.00 $26.25

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

iphone7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000363
$6.67

iphone7 Stencil Template

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
$21.00 $26.25

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

Samsung Exynos9810S9S9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000364
$10.01

Samsung Exynos9810/S9/S9+ Stencil Template

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
$21.00 $26.25

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
$21.00 $26.25

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

FM880PAAY43KA Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000365
$11.63

FM880PAAY43KA Stencil Template 90*90

ZM151032B1238 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000367
$6.30

ZM151032B1238 Stencil Template

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
$21.00 $26.25

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54308U MGEQ2LLA

PO000025
$21.00 $26.25

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4308U MGEQ2LL/A

  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD388LLA

PO000019
$21.00 $26.25

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD388LL/A

GK106220A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000357
$7.54

GK106-220-A1 Stencil Template

  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000020
$21.00 $26.25

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

iphone7 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000363
$6.67

iphone7 Stencil Template

  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
$21.00 $26.25

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

Samsung Exynos9810S9S9 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000364
$10.01

Samsung Exynos9810/S9/S9+ Stencil Template

  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
$21.00 $26.25

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
$21.00 $26.25

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

FM880PAAY43KA Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000365
$11.63

FM880PAAY43KA Stencil Template 90*90

ZM151032B1238 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000367
$6.30

ZM151032B1238 Stencil Template

  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
$21.00 $26.25

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54308U MGEQ2LLA

PO000025
$21.00 $26.25

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4308U MGEQ2LL/A