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  • Categories: Bios Chip Programming
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A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8600 MC270LLA

PO000011
kr200.66 kr250.83

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8600 MC270LL/A

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AD ADP3212

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000345
kr38.46

AD ADP3212

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A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
kr200.66 kr250.83

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

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RICHTEK RT8166BZQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000351
kr38.46

RICHTEK RT8166BZQW

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A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 MC438LLA

PO000013
kr200.66 kr250.83

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 MC438LL/A

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TI BQ24753ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000355
kr38.46

TI BQ24753ATI

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Maxim MAX1772EEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000360
kr38.46

Maxim MAX1772EEI

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A1347 EMC 2442 Bios Chip EFI Firmware 820-2993 Mid2011 Core i5 I52415M MC815LLA

PO000014
kr200.66 kr250.83

A1347 EMC 2442 Bios EFI Firmware 820-2993 Mid-2011 Core i5 I5-2415M MC815LL/A

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A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
kr200.66 kr250.83

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

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Realtek RTM862485

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000362
kr44.27

Realtek RTM862-485

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A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
kr200.66 kr250.83

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

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TI BQ24751ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000366
kr38.46

TI BQ24751ATI

  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8600 MC270LLA

PO000011
kr200.66 kr250.83

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8600 MC270LL/A

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Compare

AD ADP3212

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000345
kr38.46

AD ADP3212

wishlist
Compare
  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 BTOCTO

PO000012
kr200.66 kr250.83

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 BTO/CTO

wishlist
Compare

RICHTEK RT8166BZQW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000351
kr38.46

RICHTEK RT8166BZQW

wishlist
Compare
  • -20%

A1347 EMC 2364 Bios Chip EFI Firmware 820-2577 Mid2010 Core 2 Duo P8800 MC438LLA

PO000013
kr200.66 kr250.83

A1347 EMC 2364 Bios EFI Firmware 820-2577 Mid-2010 Core 2 Duo P8800 MC438LL/A

wishlist
Compare

TI BQ24753ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000355
kr38.46

TI BQ24753ATI

wishlist
Compare

Maxim MAX1772EEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000360
kr38.46

Maxim MAX1772EEI

wishlist
Compare
  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-2993 Mid2011 Core i5 I52415M MC815LLA

PO000014
kr200.66 kr250.83

A1347 EMC 2442 Bios EFI Firmware 820-2993 Mid-2011 Core i5 I5-2415M MC815LL/A

wishlist
Compare
  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i5 I52520M MC816LLA

PO000015
kr200.66 kr250.83

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i5 I5-2520M MC816LL/A

wishlist
Compare

Realtek RTM862485

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000362
kr44.27

Realtek RTM862-485

wishlist
Compare
  • -20%

A1347 EMC 2442 Bios Chip EFI Firmware 820-3059 Mid2011 Core i7 I72620M BTOCTO

PO000016
kr200.66 kr250.83

A1347 EMC 2442 Bios EFI Firmware 820-3059 Mid-2011 Core i7 I7-2620M BTO/CTO

wishlist
Compare

TI BQ24751ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000366
kr38.46

TI BQ24751ATI

wishlist
Compare
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