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  • Categories: Apple Parts, BIOS EMC, SMC
  • Categories: Other BGA Chips & ICs
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Maxim MAX15119

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000201
€3.45

Maxim MAX15119

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ITE IT8752TE BXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000207
€3.45

ITE IT8752TE (BXS)

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Wireless Bluetooth Stereo Headset For iPhone Samsung

Product Description

Features of I7 bluetooth headset:

1. listening to the song correct, support songs and call,

2. remind call number, the last call back, all intelligent Chinese and English voice prompts, boot, pair, shut down the phone power will be low voice prompts;

3. Power capacity will show on your Apple Iphone, you can see the power situation anytime, do not worry about the electricity ,make your life without worry;

4. Can be connected to two mobile phones at the same time

5. Bluetooth headset connected to the phone after the shutdown, and then open the Bluetooth headset will connect back to the phoneautomatically, more convenient;

6. Intelligent compatibility: support all Bluetooth mobile phone, tablet, notebook, singing it, QQ music, movies, etc., universal all mobile phone;

Specification:

1. Driver: 15mm

2. Impedance: 32 OHM

3. Bluetooth version: Bluetooth v4.1 + EDR

4. Bluetooth use band: 2.4GHz

5. Power level: CLASS II

6. Output power: 30mW

7. Bluetooth distance: 10 meters barrier

8. Frequency response: 20-20000Hz

9. Operating voltage range: 3.0V-4.2V

10. Mitou sensitivity: -42dB

11. With A2DP / AVRCP high quality stereo audio transmission and remote control protocol

12. Powerful noise de-noising circuit (active noise reduction)

13. switch between Chinese and English (boot does not connect Bluetooth state, press the switch 2 times, hear the tone switch successfully)

14. Charging time about 1 hour (power indicator charging: red light, full power: red light off (blue light).)

15. Product Size: Length 25MM. Width 15MM. High 35mm

16. Talk time is about 4-5 hours

17. music time about 4-5 hours

18. Standby time is about 120 hours

19. The charging time is about 60 minutes

20. Battery capacity 60MAH

Package Includes:

2*mini Bluetooth Headphones (2pcs)

1*USB Charging Cable

1*User Manual

CH000403
€33.44

Wireless Bluetooth Stereo Headset For iPhone Samsung

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RICHTEK RT8058GQW CB WQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
€3.45

RICHTEK RT8058GQW CB= (WQFN

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Apple BIOS MBA 13 2013 A1466 8203437 EMC2632

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000430
€30.71

Apple BIOS MBA 13 2013 A1466 820-3437 EMC2632

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AO4304L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000221
€3.45

AO4304L

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Maxim MAX8730E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000222
€3.97

Maxim MAX8730E

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Winbond WPCE776SA0DG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000223
€6.35

Winbond WPCE776SA0DG

Maxim MAX15119

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000201
€3.45

Maxim MAX15119

wishlist
Compare

ITE IT8752TE BXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000207
€3.45

ITE IT8752TE (BXS)

wishlist
Compare

Wireless Bluetooth Stereo Headset For iPhone Samsung

Product Description

Features of I7 bluetooth headset:

1. listening to the song correct, support songs and call,

2. remind call number, the last call back, all intelligent Chinese and English voice prompts, boot, pair, shut down the phone power will be low voice prompts;

3. Power capacity will show on your Apple Iphone, you can see the power situation anytime, do not worry about the electricity ,make your life without worry;

4. Can be connected to two mobile phones at the same time

5. Bluetooth headset connected to the phone after the shutdown, and then open the Bluetooth headset will connect back to the phoneautomatically, more convenient;

6. Intelligent compatibility: support all Bluetooth mobile phone, tablet, notebook, singing it, QQ music, movies, etc., universal all mobile phone;

Specification:

1. Driver: 15mm

2. Impedance: 32 OHM

3. Bluetooth version: Bluetooth v4.1 + EDR

4. Bluetooth use band: 2.4GHz

5. Power level: CLASS II

6. Output power: 30mW

7. Bluetooth distance: 10 meters barrier

8. Frequency response: 20-20000Hz

9. Operating voltage range: 3.0V-4.2V

10. Mitou sensitivity: -42dB

11. With A2DP / AVRCP high quality stereo audio transmission and remote control protocol

12. Powerful noise de-noising circuit (active noise reduction)

13. switch between Chinese and English (boot does not connect Bluetooth state, press the switch 2 times, hear the tone switch successfully)

14. Charging time about 1 hour (power indicator charging: red light, full power: red light off (blue light).)

15. Product Size: Length 25MM. Width 15MM. High 35mm

16. Talk time is about 4-5 hours

17. music time about 4-5 hours

18. Standby time is about 120 hours

19. The charging time is about 60 minutes

20. Battery capacity 60MAH

Package Includes:

2*mini Bluetooth Headphones (2pcs)

1*USB Charging Cable

1*User Manual

CH000403
€33.44

Wireless Bluetooth Stereo Headset For iPhone Samsung

wishlist
Compare

RICHTEK RT8058GQW CB WQFN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
€3.45

RICHTEK RT8058GQW CB= (WQFN

wishlist
Compare

Apple BIOS MBA 13 2013 A1466 8203437 EMC2632

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000430
€30.71

Apple BIOS MBA 13 2013 A1466 820-3437 EMC2632

wishlist
Compare

AO4304L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000221
€3.45

AO4304L

wishlist
Compare

Maxim MAX8730E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000222
€3.97

Maxim MAX8730E

wishlist
Compare

Winbond WPCE776SA0DG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000223
€6.35

Winbond WPCE776SA0DG

wishlist
Compare
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