Product Description
SOP16/8-DIP8 REV3 Board 1PCS
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
QFP64 to DIP64 CHIP PROGRAMMER SOCKET QFP64-0.5-REV2 adapter socket
TSOP48-DIP48 Socket TSOP-48-0.5-OTS04B for RT809H programmer
DX1016 Adapter for XELTEK SuperPro 6100N
Brand new 40 Pin Dip 2.54mm ZIF Lock IC Test Socket 40T m
GX1016-P008 Adapter for XELTEK SuperPro 7500
X-PROG Box ECU Programmer XPROG-M V6.12 with USB Dongle
ADP-SSO-056-0.8 For XGecu T56 Programmer
PIC Microcontroller K150 Automatic USB Programming Programmer ICSP Cable
XELTEK SuperPro 6104N Universal IC Chip Device Programmer
PLCC28 Adapter for PLCC28-DIP24 turn programmer test IC adapter for USB programmer universal
DX3016 Adapter for XELTEK SuperPro 6100N
DX1004-1 Adapter for XELTEK SuperPro 6100N
OBDSTAR X300 DP Plus X300 PAD2 8inch Tablet (Full package) C Package
PLCC44 Adapter for PLCC44-DIP40 turn programmer test IC adapter for USB programmer universal
eMMC FBGA169/BGA153 Adapter 11.5*13 to SD
2018 Latest Version XPROG-M V5.84 X-PROG Box ECU Programmer with USB Dongle
SOP16/8-DIP8 REV3 Board
