Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Nessuna opinione al momento
16 other products in the same category
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template
BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template
i37100U SR2ZW Stencil Template 90x90
i3-7100U SR2ZW Stencil Template 90*90
i56300HQ SR2FP Stencil Template 90x90
i5-6300HQ SR2FP Stencil Template 90*90
A1707 A1706 339S00056 SR2NH SR27N H67388 SN6508 Stencil Template
A1707 A1706 339S00056 SR2NH SR27N H67388 SN6508 Stencil Template
i76820HQ SR2FU Stencil Template 90x90
I7-6820HQ SR2FU Stencil Template 90*90
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90x90
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82H82H87 Stencil Template 90*90