Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

RT809H special seat LFBGA48-8X6 0.8 spacing

Applicable to set-top boxes commonly used MX29GL640, S29GL064N and other models of NOR flash offline reading and writing seat

Encapsulation is LFBGA48, 8*6mm, spacing 0.8mm

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

Part Number V23084-C2002-A403

MPN BMW Car Locking System , Volkswagen Locking System

In package Original relay

Chipsetpro.com

Chipsetpro.com

Powerful Backup Charge Cable:

As fast as your original USB-C cable. Best choice to backup for home, work or travel.

High Speed Syncing:

Transfer data from all your USB-C devices at speeds of up to 480 Mbps.

Reversible Connector:

USB-C's user-friendly design helps you plug and unplug easily without checking for the connector orientation.

High Quality:

CHOE usb type c cable with sturdy construction has connectors with molded strain relief for frequent unplugging and durability.

Popular USB C Cable Compatibility List:

For Apple(2015) new MacBook with 12" Retina Display

For 2015 Google Chromebook Pixel

For HP Pavilion x2

For Nokia N1

For Lenovo Zuk Z1

For Google Nexus 5X / 6P

For Google Pixel C

For Microsoft Lumia 950 / 950 XL

For ASUS Z580C tablet

And More

Specifications

Item: USB Type C Cable

Current Output: 5V 3A(Max)

Date Transfer: USB 2.0/480Mbps

Important Note:

1.Compatible with the USB Type-C port on the Apple USB-C Digital AV Multiport Adapter for charging only.

2.This cable is not compatible with OnePlus 2.

1 x USB Type C Cable

Chipsetpro.com

Chipsetpro.com

TL866II PLUS Programmer can use for items list:

Login to Download: Download software Device Support List instruction manual

Programmer Overview

1.1 Performance Introduction

Carefully built low-cost professional programmer, high-density chip production process, a

unified user interface, easy to use, functional integrity, application software, reliable

operation, code small, faster execution. supported operating system:

WINXP WIN2003 WIN2008 VISTA WIN7 WIN8 WIN10 32-bit or 64-bit operating system

? The programming speed is greatly improved. It is suitable for small batch production and supports 4 programmers for one computer.

? A wide range of chip support, the initial version supports the chip 15000+, supports a variety of 24 25 26 27 28 29 37 39 49 50 series of serial and parallel memory chips, microcontroller 51 series, ATMEL AVR ATMEGA AT90 series, MICROCHIP PIC10 PIC12 PIC16 PIC18 series microcontroller , GAL programmable logic device programming, SRAM test, 54/74 and CMOS4000 integrated circuit integrated functional test.

Support NAND Flash chip, the function is complete and comprehensive, the capacity supports to 8Gbits.

25 series Nor Flash capacity support to 512Mbits.

? Pin contact check function, poor contact pin can pinpoint

? Ultra-low power consumption: the entire programmer uses ultra-low-power chips, using USB interface, the first truly all chip programming

without external power integrated programmer. Portable performance super: the world's smallest volume, size 10CM * 6CM * 2.5CM, only the size of the driver's license.

? Programmable VCC from 1.8V to 6.5V, VPP from 1.8V to 18V chip

? Chip serial number secondary development functions: Programmer built a variety of commonly used automatic numbering function. And can use a custom algorithm to achieve any sequence number through DLL dynamic library. This feature allows you to produce

a unique identification info rmation for each chip in mass production. The logo can also be encrypted with a custom algorithm to more effectively protect your product's rights.

? Universal serial programming interface ICSP (to support both high-voltage parallel programming and low-volt age serial programming). Note: ICSP now supports 24-Series 25 Series 93 Series Serial Integrated Circuits, ATMEL89S51,52, AVR ATMEGAxxx Full

Series, and MICROCHIP PIC10Fxxx 12Fxxx 16Fxxx 18Fxxx Full Series, and the new series of SYNCMOS SM59Dxx SM59Rxx fu ll range chips for in-circuit serial programming.

? Powerful 54 / 74F / LS / HC CMOS4000 Series Integrated Functionality Tests: The First Development Programmer to Test Common Logic ICs True, Test Errors Locating Logic Gate Circuits, Test Arbitrary Possible input combinations.

1.2 Programmer chip support range

? Variety of 26 27 28 29 37 39 49 50 series of parallel ROM, EPROM, EEPROM

Fast, full support. Support TSOP32 TSOP40 TSOP48 chips to 64MBits, will join the TSOP56 pin support.

(TL866II programming voltage VPP only supports up to 18V, for early 27C series ROM, the

chip with 21V 25V VPP voltage no longer supports writing, but can be read. If it is used,

the VPP with the same type of programming voltage can be used as 13V or 12V chip replacement, for example: 27C32 21V or 13V Vpp chip,Pay attention to the VPP voltage)

? 24 25 35 45 85 93 95 Series Serial EEPROM

Serial Series Chip Support Full, Supports Chip Capacity 25 Series 8 or 16PIN to 512MBits (64M Bytes)

? NAND FLASH chip supports up to 8Gbits

? MCU series, hundreds of models of 51 series of microcomputer

? AVR microcontroller package scratch ATMEGA series ATtiny series AT90XXX series of microcontrollers, all AVR ATMEGAxxx chip also supports the ICSP interface for SPI serial download programming. Support AVR one-to-one soft-key with RC correction byte.

? MICROCHIP PIC10 PIC12 PIC16 PIC18 Series Microcontroller:

PIC series of more than 300 models, more than 900 package chip support, currently supports

one of the most complete PIC chip integrated programmer. For vario

us types of PIC monolithic, in strict accordance with the manufacturer's manual requirements, the optimal programming, programming speed is excellent. The vast majority of chips support both ISCP online programming and programming through programming sockets.

? GAL programmable logic device programming

? SRAM test

Support for common 24 61 62 DS12 series SRAM test, respectively, to data line testing,

address line testing, memory unit incremental testing and unit testing.

? Super performance 54 / 74F / LS / HC CMO

S4000 series integrated circuit integrated

Function test:

The first development-type programmer to really test common logic ICs to test for errors

that can be located to logic gates, and to test any possible combinations of inputs in an integrated circuit when testing.

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Chipsetpro.com

Chipsetpro.com