• Show Sidebar

Jest 1690 produktów.

Aktywne filtry

  • Kategorie: BGA Chips & IC
  • Kategorie: Obsługa
wishlist
Compare
Quickview

RCHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
3,45 €

RT8809B 08=08

wishlist
Compare
Quickview

Osram LED – SMD Yellow 590 nm 3528 PLCC6 (ang.)

  • Product: Yellow LEDs
  • Mounting Style: SMD/SMT
  • Package/Case: PLCC-6
  • Illumination Colour: Yellow
  • Wavelength/Colour Temperature: 590 nm
  • Luminous Intensity: 2.8 cd
  • Luminous Flux/Radiant Flux: 9.5 lm
  • Lens Colour/Style: Water Clear
  • If - Forward Current: 140 mA
  • Vf - Forward Voltage: 2.2 V
  • Power Rating: 1 W
  • Length: 3.2 mm
  • Width: 3 mm
  • Height: 1.9 mm
  • Minimum Operating Temperature: - 40 C
  • Maximum Operating Temperature: + 110 C
  • Series: Advanced Power TOPLED
  • Brand: OSRAM Opto Semiconductors
  • LED Size: 3.2 mm x 3 mm x 1.9 mm
  • Lens Shape: Round Flat
  • Viewing Angle: 120 deg
LD000007
0,33 €
wishlist
Compare
Quickview

FUJITSU MB3887 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
3,45 €

FUJITSU MB3887 (ANG.)

wishlist
Compare
Quickview

RALINK RT3050F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
3,45 €

RALINK RT3050F (ANG.)

wishlist
Compare
Quickview

NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
3,45 €

NT71209FG-810

wishlist
Compare
Quickview

INTELLE82GME965 SLA9F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
22,24 €

INTELLE82GME965 SLA9F (ANG.)

wishlist
Compare
Quickview

Maksym MAX151

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000201
3,45 €

Maksym MAX151

wishlist
Compare
Quickview

ITE IT8752TE BXS (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000207
3,45 €

ITE IT8752TE (ANG.)

wishlist
Compare
Quickview

RICHTEK RT8058GQW CB WQFN (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
3,45 €

RICHTEK RT8058GQW CB= (ANG.)

Scanner Golo Master 2.0 OBD2 (ang.) Interface

Vehicle Diagnostics Interface Golo 2.0
Condition: USED, Worked perfect
In packing included: 
1. Diagnostic adapter Golo OBD-II
2. OBD-II cover
3. OBD-II extension adapter
Full System Scan
GO000001
199,00 €
1. Golo OBD-II (ang.)
Okładka 2
3. adapter OBD-II
pakiet 4
wishlist
Compare

RCHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
3,45 €

RT8809B 08=08

wishlist
Compare

Osram LED – SMD Yellow 590 nm 3528 PLCC6 (ang.)

  • Product: Yellow LEDs
  • Mounting Style: SMD/SMT
  • Package/Case: PLCC-6
  • Illumination Colour: Yellow
  • Wavelength/Colour Temperature: 590 nm
  • Luminous Intensity: 2.8 cd
  • Luminous Flux/Radiant Flux: 9.5 lm
  • Lens Colour/Style: Water Clear
  • If - Forward Current: 140 mA
  • Vf - Forward Voltage: 2.2 V
  • Power Rating: 1 W
  • Length: 3.2 mm
  • Width: 3 mm
  • Height: 1.9 mm
  • Minimum Operating Temperature: - 40 C
  • Maximum Operating Temperature: + 110 C
  • Series: Advanced Power TOPLED
  • Brand: OSRAM Opto Semiconductors
  • LED Size: 3.2 mm x 3 mm x 1.9 mm
  • Lens Shape: Round Flat
  • Viewing Angle: 120 deg
LD000007
0,33 €
wishlist
Compare

FUJITSU MB3887 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
3,45 €

FUJITSU MB3887 (ANG.)

wishlist
Compare

RALINK RT3050F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
3,45 €

RALINK RT3050F (ANG.)

wishlist
Compare

NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
3,45 €

NT71209FG-810

wishlist
Compare

INTELLE82GME965 SLA9F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
22,24 €

INTELLE82GME965 SLA9F (ANG.)

wishlist
Compare

Maksym MAX151

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000201
3,45 €

Maksym MAX151

wishlist
Compare

ITE IT8752TE BXS (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000207
3,45 €

ITE IT8752TE (ANG.)

wishlist
Compare

RICHTEK RT8058GQW CB WQFN (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000217
3,45 €

RICHTEK RT8058GQW CB= (ANG.)

wishlist
Compare
Back to top