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  • Kategorie: BGA Reballing Kits, Stencil
  • Kategorie: Obsługa
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GF114400 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000169
5,47 €

GF114-400A1

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21608100 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005258
9,97 €

2160810028 stencil

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Osram LED – SMD Yellow 590 nm 3528 PLCC6 (ang.)

  • Product: Yellow LEDs
  • Mounting Style: SMD/SMT
  • Package/Case: PLCC-6
  • Illumination Colour: Yellow
  • Wavelength/Colour Temperature: 590 nm
  • Luminous Intensity: 2.8 cd
  • Luminous Flux/Radiant Flux: 9.5 lm
  • Lens Colour/Style: Water Clear
  • If - Forward Current: 140 mA
  • Vf - Forward Voltage: 2.2 V
  • Power Rating: 1 W
  • Length: 3.2 mm
  • Width: 3 mm
  • Height: 1.9 mm
  • Minimum Operating Temperature: - 40 C
  • Maximum Operating Temperature: + 110 C
  • Series: Advanced Power TOPLED
  • Brand: OSRAM Opto Semiconductors
  • LED Size: 3.2 mm x 3 mm x 1.9 mm
  • Lens Shape: Round Flat
  • Viewing Angle: 120 deg
LD000007
0,33 €
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N3150 templariusz

N3150 SR29F Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000173
6,22 €

N3150 templariusz

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21607708 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000177
5,40 €

216-07708 templariusz

Scanner Golo Master 2.0 OBD2 (ang.) Interface

Vehicle Diagnostics Interface Golo 2.0
Condition: USED, Worked perfect
In packing included: 
1. Diagnostic adapter Golo OBD-II
2. OBD-II cover
3. OBD-II extension adapter
Full System Scan
GO000001
199,00 €
1. Golo OBD-II (ang.)
Okładka 2
3. adapter OBD-II
pakiet 4
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GF114400 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000169
5,47 €

GF114-400A1

wishlist
Compare

21608100 stencil

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005258
9,97 €

2160810028 stencil

wishlist
Compare

Osram LED – SMD Yellow 590 nm 3528 PLCC6 (ang.)

  • Product: Yellow LEDs
  • Mounting Style: SMD/SMT
  • Package/Case: PLCC-6
  • Illumination Colour: Yellow
  • Wavelength/Colour Temperature: 590 nm
  • Luminous Intensity: 2.8 cd
  • Luminous Flux/Radiant Flux: 9.5 lm
  • Lens Colour/Style: Water Clear
  • If - Forward Current: 140 mA
  • Vf - Forward Voltage: 2.2 V
  • Power Rating: 1 W
  • Length: 3.2 mm
  • Width: 3 mm
  • Height: 1.9 mm
  • Minimum Operating Temperature: - 40 C
  • Maximum Operating Temperature: + 110 C
  • Series: Advanced Power TOPLED
  • Brand: OSRAM Opto Semiconductors
  • LED Size: 3.2 mm x 3 mm x 1.9 mm
  • Lens Shape: Round Flat
  • Viewing Angle: 120 deg
LD000007
0,33 €
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N3150 templariusz

N3150 SR29F Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000173
6,22 €

N3150 templariusz

wishlist
Compare

21607708 templariusz

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000177
5,40 €

216-07708 templariusz

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