NH820801GBM SL8YB Stencil Template (ang.)

5,40 €
Netto

NH820801GBM SL8YB Stencil Template (ang.)

Chipsetpro.com

Chipsetpro.com

Ilość
Delivery will take 14-28 days

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002337

Na razie nie dodano żadnej recenzji.

Napisz swoją opinię

NH820801GBM SL8YB Stencil Template (ang.)

NH820801GBM SL8YB Stencil Template (ang.)

Napisz swoją opinię

16 other products in the same category