Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
16 other products in the same category
3955U SR2EW Stencil Template (ang.)
3955U SR2EW Stencil Template (ang.)
i34030U SR1EN Stencil Template 90x90 (ang.)
I3-4030U SR1EN Stencil Template 90*90 (ang.)
SLJ8E Stencil Solder Station Kits (ang.)
SLJ8E Stencil Solder Station Kits (ang.)
25Q64, LM36272 36273 36274 BGA24 Stencil Template (ang.)
25Q64, LM36272 36273 36274 BGA24 Stencil Template (ang.)
N17EESA1 Stencil Template 90x90 (ang.)
N17E-ES-A1 Stencil Template 90 (ang.)