Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
16 other products in the same category
AC82GM45 SLB94 Stencil Template (ang.)
AC82GM45 SLB94 Stencil Template (ang.)
Celeron DualCore (ang.) templariusz
Celeron Dual-Core (ang.) templariusz
i73517U SR0N6 Stencil Template (ang.)
I7-3517U SR0N6 Stencil Template (ang.)
N3510 SR1LV Stencil Template (ang.)
N3510 SR1LV Stencil Template (ang.)
i73667U SR0N5 Stencil Template 90x90 (ang.)
SR0N5 Stencil Template 90*90 (ang.)
2160728016 Stencil Template 90x90 (ang.)
216-0728016 Stencil Template 9090 (ang.)