Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
16 other products in the same category
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U templariusz
SRCKB SRCUU SRD1V SREJP SREJQ SREJR SRF6X SRFFX SRFFZ SRGKW 8265U templariusz
Pentium DualCore (ang.) Mobile Stencil Template 90x90x
Pentium Dual-Core Mobile Stencil Template 90*90 (ang.)
i52415M SR071 Stencil Template 90x90x (ang.)
I5-2415M SR071 Stencil Template 90*90 (ang.)
i34030U SR1EN Stencil Template 90x90 (ang.)
I3-4030U SR1EN Stencil Template 90*90 (ang.)