Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
16 other products in the same category
3558U SR1E8 Stencil Template (ang.)
3558U SR1E8 Stencil Template (ang.)
A1707 A1706 339S00056 SR2NH H67388 SN650839 (ANG.) templariusz
A1707 A1706 339S00056 SR2NH H67388 SN650839 (ANG.) templariusz
SONY PS3 D5305AFK (ANG.) templariusz
SONY PS3 D5305AFK (ANG.) templariusz
BCM4709 BCM4709C0KFEBG BCM4709 stencil
BCM4709 BCM4709C0KFEBG BCM4709 stencil
SR3RZ Stencil Solder Station Kits (ang.)
SR3RZ Stencil Solder Station Kits (ang.)