Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
Na razie nie dodano żadnej recenzji.
250KTC 055mm Sn965/Ag3/Cu0.5 BGA (ang.) Oficjalna strona Pb/Lead Free Solder Ball
Oficjalna strona Lenovo Thinkpad Edge E430 E435 E430C E530C E530C E530C E535
6in1 Repair Open Metal Spudger (ang.) Pry Tools Disassemble Set
LVDS Cable for screen Acer 7551G 775141G (ang.) LED P/N: 50.4HN001 50.4HN01.011 50.4HN011 50,4HN012
DC Power Supply DPS-305BF Digital Control DC (ang.)
Adhesive Glue B-7000 for Mobile Phone Universal (ang.)
ESP8266 ESP-12E UART WIFI Wireless Shield Development Board (ang.)
PS-10A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 2.0L (ang.)
T13-BL BaKon zintegrował ogrzewanie rdzenia bezprzewodowego 75W stałej temperatury lutowania żelaza
VETUS ESD-14 Safe Anti-Static Stainless Steel Tweezers (ang.)
16MP Digital HDMI USB Microscopio Camera 4.0X simul-focal
Wireless Smart 5USB Display Charger 818PF (ang.)
800pc Anti-Static ESD Rubber Finger Cot Protector Cover (ang.)
LVDS Cable for screen Asus X550 A550 R510 p/n: 1422-01FV000 1422-01FY000 1422-01M6000 1422-01M6000 1422-0108 1422-01-01FY-01FY000 1422-01M6000 1422-01M6000 1422-0108-0108-0108 Okładka
FOXCONN CPU Sockel mPGA 479M BGA socket
