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GF114400A1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002078
zl73.04

GF114-400-A1 Stencil Template 90*90

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i34005U SR1EK Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002079
zl23.30

i3-4005U SR1EK Stencil Template

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N13MGE7BA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002080
zl23.01

N13M-GE7-B-A1 Stencil Template

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RICHTEK RT8208A FF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002082
zl14.70

RICHTEK RT8208A (FF=)

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STXRLINK STM8 ST7 STM32 STR7 STR9 Incircuit Debugger Programmer Supporting JTAG and ICC Protocols

STX-RLINK is adapted for the St series MCU a versatile Tools for Economic Development. It can be downloaded on line simulation and St stm8, ST7, STM32, str7 and str9 Family of devices.

Software supported

The direct support of ride7 raisonance and rflasher7.

Official St IDE (Integrated Development Environment software) ST (STVD) visual Development and visual recording software program (St stvp).

Compatible Devices

Swim interface with support for all the stm8 MCU

Supports all ST7 MCU interface with ICC

With JTAG interface supports all str7 / SWD STM32 MCU, and str9

Functionality, performance

Functions of programming: The Programming of Flash ROM, EEPROM, etc.

The Simulation Capabilities: support to run at full speed, stepping, breakpoints, and another method of Cleansing, you can see the State of the variable Data, etc.

Simulation of Performance debugging Simulation: USB2.0 interface, Step by step, breakpoints, Rapid Response!

Program Performance: USB2.0 interface to swim / ICC / / SWD JTAG download, download speed!

Special Note: STX RLINK can't Trace. Original explained as follows:

The RLINK includes no support for Tracing devices based on arm kernel and Trace macrocell with Embedded System such as str9. With the capacity of monitoring tools are available in the str9 Professional Developer Kit (DK / raisonance str9 - Signum jtagjet RAIS), and in the str91x Advanced Developer's kit (IAR str91xdk / IAR) with J Trace.

Using the USB Interface to connect the PC

STX RLINK Integrated Development Tools, drivers, USB high speed communication.

Upgradeable firmware

In the Future, will launch more St stm8, ST7, STM32, str7 and str9 Models, the new device is added to the list of compatible devices and ride7 STVD Model, when you need to use in the future development of new models, and updates ride7 STVD, Firmware Update, should be supported by new models

Package Contains:

STX RLINK x 1

USB type B type cable x 1

Swim cable x 1

ICC / 4 - pin Adapter Adapter x 1 swim

JTAG Adapter x 1

SWD 20 pin JTAG - x 1

Does not contain CD software program

CH002083
zl730.91

STX-RLINK STM8 ST7 STM32 STR7 STR9 In-circuit Debugger Programmer Supporting JTAG and ICC Protocols

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2160732026

216-0732026

Part Number 216-0732026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2009+

Package/Case 360 Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002084
zl111.28

216-0732026

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TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for RT809H TNM5000 Programmer - Pin to Pin

CH002085
zl119.29

TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

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19106127

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002086
zl575.24

1910-6127

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SR2KN Stencil Template

SR2KN Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002087
zl26.48

SR2KN Stencil Template

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2180755113 M1 FCH

218-0755113 M1 FCH

Part Number 218-0755113 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1214

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002088
zl96.45

218-0755113 M1 FCH

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Intersil ISL6247CR

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002089
zl14.70

Intersil ISL6247CR

GF114400A1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002078
zl73.04

GF114-400-A1 Stencil Template 90*90

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Compare

i34005U SR1EK Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002079
zl23.30

i3-4005U SR1EK Stencil Template

wishlist
Compare

N13MGE7BA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002080
zl23.01

N13M-GE7-B-A1 Stencil Template

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Compare

RICHTEK RT8208A FF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002082
zl14.70

RICHTEK RT8208A (FF=)

wishlist
Compare

STXRLINK STM8 ST7 STM32 STR7 STR9 Incircuit Debugger Programmer Supporting JTAG and ICC Protocols

STX-RLINK is adapted for the St series MCU a versatile Tools for Economic Development. It can be downloaded on line simulation and St stm8, ST7, STM32, str7 and str9 Family of devices.

Software supported

The direct support of ride7 raisonance and rflasher7.

Official St IDE (Integrated Development Environment software) ST (STVD) visual Development and visual recording software program (St stvp).

Compatible Devices

Swim interface with support for all the stm8 MCU

Supports all ST7 MCU interface with ICC

With JTAG interface supports all str7 / SWD STM32 MCU, and str9

Functionality, performance

Functions of programming: The Programming of Flash ROM, EEPROM, etc.

The Simulation Capabilities: support to run at full speed, stepping, breakpoints, and another method of Cleansing, you can see the State of the variable Data, etc.

Simulation of Performance debugging Simulation: USB2.0 interface, Step by step, breakpoints, Rapid Response!

Program Performance: USB2.0 interface to swim / ICC / / SWD JTAG download, download speed!

Special Note: STX RLINK can't Trace. Original explained as follows:

The RLINK includes no support for Tracing devices based on arm kernel and Trace macrocell with Embedded System such as str9. With the capacity of monitoring tools are available in the str9 Professional Developer Kit (DK / raisonance str9 - Signum jtagjet RAIS), and in the str91x Advanced Developer's kit (IAR str91xdk / IAR) with J Trace.

Using the USB Interface to connect the PC

STX RLINK Integrated Development Tools, drivers, USB high speed communication.

Upgradeable firmware

In the Future, will launch more St stm8, ST7, STM32, str7 and str9 Models, the new device is added to the list of compatible devices and ride7 STVD Model, when you need to use in the future development of new models, and updates ride7 STVD, Firmware Update, should be supported by new models

Package Contains:

STX RLINK x 1

USB type B type cable x 1

Swim cable x 1

ICC / 4 - pin Adapter Adapter x 1 swim

JTAG Adapter x 1

SWD 20 pin JTAG - x 1

Does not contain CD software program

CH002083
zl730.91

STX-RLINK STM8 ST7 STM32 STR7 STR9 In-circuit Debugger Programmer Supporting JTAG and ICC Protocols

wishlist
Compare

2160732026

216-0732026

Part Number 216-0732026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2009+

Package/Case 360 Description Manufacturer refurbished

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002084
zl111.28

216-0732026

wishlist
Compare

TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

CHIP PROGRAMMER SOCKET TQFP44 TO DIP44 adapter socket support ATMEGA8 series

Description:

Best quality, QFP44 to 44Dip Adapter

Suitable for QFP44 IC

patch size : 0.8mm 10mm * 10mm

Feature:

Support Atmel Atmega TQFP44 device

eg.mega328 mega8A mega48 mega8 mega88 mega16 mega162 mega168

Comes with AVRISP header, directly connect to AVRISP, USBASP, MkII, for direct burning of firmware or arduino bootloaders

Crysal header so that crystal can be replaced easily

Convert to DIP44 Atmega328 format, Pin to pin comptabile with Atmega DIP44 MCU format

Package included:

Programmer Adapter QFP44 to DIP44

Note:

Type A: Use for XELTEK USB Programmer - Overlapping

Type B: Use for RT809H TNM5000 Programmer - Pin to Pin

CH002085
zl119.29

TQFP44 to DIP44 Programmer Adapter Socket for RT809H TNM5000 T56 programmer

wishlist
Compare

19106127

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002086
zl575.24

1910-6127

wishlist
Compare

SR2KN Stencil Template

SR2KN Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002087
zl26.48

SR2KN Stencil Template

wishlist
Compare

2180755113 M1 FCH

218-0755113 M1 FCH

Part Number 218-0755113 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1214

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002088
zl96.45

218-0755113 M1 FCH

wishlist
Compare

Intersil ISL6247CR

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002089
zl14.70

Intersil ISL6247CR

wishlist
Compare
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