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IXP460 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002381
€5.40

IXP460 Stencil Template

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DC Power Jack Part PJ061

Asus EEE PC 1001 Series DC Power Jack Connector: 1001HA, 1001HAG, 1001HT, 1001P, 1001PD, 1001PG, 1001PQ, 1001PQD, 1001PX. 1001PXB, 1001PXD

Asus EEE PC 1002 Series DC Power Jack Connector: 1002H, 1002HA, 1002HAE, 1002SA

Asus EEE PC 1003 Series DC Power Jack Connector: 1003H, 1003HA, 1003HAG

Asus EEE PC 1004 Series DC Power Jack Connector: 1004DN

Asus EEE PC 1005 Series DC Power Jack Connector: 1005, 1005HA, 1005HA_GG, 1005HAB, 1005HAG, 1005HE, 1005HR, 1005P, 1005PE, 1005PEG, 1005PG, 1005PR, 1005PX, 1005PXD

Asus EEE PC 1008 Series DC Power Jack Connector: 1008HA, 1008HAG, 1008P, 1008PB, 1008PGO

Asus EEE PC 1015 Series DC Power Jack Connector: 1015, 1015P, 1015PD, 1015PDG, 1015PDT, 1015PE, 1015PEB, 1015PED, 1015PEG, 1015PEM, 1015PN, 1015T

Asus EEE PC 1101 Series DC Power Jack Connector: 1101, 1101HA, 1101HA_GG, 1101HAB, 1101HAG

Asus EEE PC 1201 Series DC Power Jack Connector: 1201HA, 1201HAB, 1201HAG, 1201K, 1201N, 1201NB, 1201NE, 1201NL, 1201PN, 1201PNG, 1201T, 1201X

Asus EEE PC 1215 Series DC Power Jack Connector: 1215N, 1215P, 1215T

CH002382
€7.21

DC Power Jack, Part #PJ061

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Intersil ISL62872

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002386
€3.45

Intersil ISL62872

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2150839049 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002387
€5.40

215-0839049 Stencil Template

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SMSC KBC1122AJZS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002388
€4.77

SMSC KBC1122-AJZS

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SR33Z i77600U

SR33Z i7-7600U

Part Number i7-7600U SR33Z Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002389
€287.18

SR33Z i7-7600U

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BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002390
€5.59

BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template

IXP460 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002381
€5.40

IXP460 Stencil Template

wishlist
Compare

DC Power Jack Part PJ061

Asus EEE PC 1001 Series DC Power Jack Connector: 1001HA, 1001HAG, 1001HT, 1001P, 1001PD, 1001PG, 1001PQ, 1001PQD, 1001PX. 1001PXB, 1001PXD

Asus EEE PC 1002 Series DC Power Jack Connector: 1002H, 1002HA, 1002HAE, 1002SA

Asus EEE PC 1003 Series DC Power Jack Connector: 1003H, 1003HA, 1003HAG

Asus EEE PC 1004 Series DC Power Jack Connector: 1004DN

Asus EEE PC 1005 Series DC Power Jack Connector: 1005, 1005HA, 1005HA_GG, 1005HAB, 1005HAG, 1005HE, 1005HR, 1005P, 1005PE, 1005PEG, 1005PG, 1005PR, 1005PX, 1005PXD

Asus EEE PC 1008 Series DC Power Jack Connector: 1008HA, 1008HAG, 1008P, 1008PB, 1008PGO

Asus EEE PC 1015 Series DC Power Jack Connector: 1015, 1015P, 1015PD, 1015PDG, 1015PDT, 1015PE, 1015PEB, 1015PED, 1015PEG, 1015PEM, 1015PN, 1015T

Asus EEE PC 1101 Series DC Power Jack Connector: 1101, 1101HA, 1101HA_GG, 1101HAB, 1101HAG

Asus EEE PC 1201 Series DC Power Jack Connector: 1201HA, 1201HAB, 1201HAG, 1201K, 1201N, 1201NB, 1201NE, 1201NL, 1201PN, 1201PNG, 1201T, 1201X

Asus EEE PC 1215 Series DC Power Jack Connector: 1215N, 1215P, 1215T

CH002382
€7.21

DC Power Jack, Part #PJ061

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Intersil ISL62872

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002386
€3.45

Intersil ISL62872

wishlist
Compare

2150839049 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002387
€5.40

215-0839049 Stencil Template

wishlist
Compare

SMSC KBC1122AJZS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002388
€4.77

SMSC KBC1122-AJZS

wishlist
Compare

SR33Z i77600U

SR33Z i7-7600U

Part Number i7-7600U SR33Z Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002389
€287.18

SR33Z i7-7600U

wishlist
Compare

BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002390
€5.59

BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template

wishlist
Compare
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