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GL82HM175 SR30W

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000227
€57.44

GL82HM175 SR30W

QFN8 CNV QFN8 DFN8 MLF8 DIP8 Programmer Adapter Sockets Plus EFI SPI ROM SAM Cable BUNDLE

Product description:

This item will enable you to have accurate reads/writes SPI Flash Memory used in MacBook models.

 The following be supported: 

 A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1370 820-2855-A, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

 

In package:

 1pcs x EFI Ribbon cable

1pcs x QFN WSON Socket 6x5

1pcs x QFN WSON Socket 6x8

 

Extra Information:

Details about EFI Ribbon Cable: https://www.ebay.com/itm/133187974519

Details about WSON QFN 6x5: https://www.ebay.com/itm/133798227558

Details about WSON QFN 8x6: https://www.ebay.com/itm/133798207555

 

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Warranty

This product will have a 30-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000028
€68.00

WSON8 QFN8 Socket 6x5

WSON8 QFN8 Socket 6x8

SPI ROM EFI Cable

N16EGTA1 GTX970M

N16E-GT-A1 GTX970M

Part Number N16E-GT-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 105 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000229
€157.54

N16E-GT-A1 GTX970M

A1989 Rom Socket Assistant U2890 Notebook Chip W25Q80DVUXIE Adapter USON 2x3 0.5

Socket of ROM Chip W25Q80DV, size 3x2 U2890

You can read backup and modify of U2890 Rom Chip from 2018 to 2020 Year.

In package:  1pcs x Socket 3x2, 0.5 pitch 

Compatible U2890 for this models:

A2251 820-01949
A2289 820-01987
A2141 820-01700
A2159 820-01598
A1990 820-01041
A1989 820-00850
A1932 820-01521
A2179 820-01958

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000160
€52.00

Rom Socket Adapter Assistant USON 2x3 For U2890 W25Q80DVUXIE 

In package: 1pcs x USON 2x3, 0.5 pitch socket

Compatible:

A2251 820-01949

A2289 820-01987

A2141 820-01700

A2159 820-01598

A1990 820-01041

A1989 820-00850

A1932 820-01521

A2179 820-01958

2160856040

216-0856040

Part Number 216-0856040 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2009

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000233
€20.90

216-0856040

BGA100 BGA64 BGA153 BGA169 Socket Adapter EMMC DDR CPU Flash IC Adapter RT809H

In package included

 

1pcs x BGA64 Socket 

1pcs x frame 11*13 mm, compatible S29GL512 S29GL256 S29GL128 S29GL064 S29GL032

1pcs x frame 10*13 mm, compatible 28F640, 28F128

1pcs x frame 10*15 mm, compatible 28F256

1pcs x frame 9*9

 

1pcs x BGA153/169 Socket 

1pcs x frame 11*10 mm

1pcs x frame 11.5*13 mm 

1pcs x frame 12*16 mm

1pcs x frame 12*18 mm

1pcs x frame 14*18 mm

 

1pcs x BGA100 Socket 

1pcs x frame 14*18 mm

  

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000163
€196.00

BGA64

BGA100

BGA153/169

SR2EU i36100U

SR2EU i3-6100U

Part Number Core i3-6100U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000252
€180.51

SR2EU i3-6100U

2160707001 HD3470

216-0707001 HD3470

Part Number 216-0707001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1004

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000269
€16.54

216-0707001 HD3470

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA100-01 V2.5

1pcs x Frame 14x18

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH001979
€89.00

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

BGA221 Socket Test Adapter EMMC 221 EMCP EMC FBGA Seat RT-BGA221 RT809H Programmer

In package included: 

1pcs x socket RT-BGA221-01 V2.5

1pcs x Frame 11.5x13

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH05437
€85.00

BGA221 Socket EMMC 221 RT-BGA221

NF7050630IA2

NF7050-630I-A2

Part Number NF7050-630I-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000270
€18.05

NF7050-630I-A2

N13PGV2SA2

N13P-GV2-S-A2

Part Number N13P-GV2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000276
€16.38

N13P-GV2-S-A2

GL82HM175 SR30W

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000227
€57.44

GL82HM175 SR30W

QFN8 CNV QFN8 DFN8 MLF8 DIP8 Programmer Adapter Sockets Plus EFI SPI ROM SAM Cable BUNDLE

Product description:

This item will enable you to have accurate reads/writes SPI Flash Memory used in MacBook models.

 The following be supported: 

 A1534 emc 2746 820-00045, A1534 emc 2991 820-00244, A1534 emc 3099 820-00687, A1370 emc 2393 820-2796, A1370 EMCXXXX 820-2955, A1370 EMCXXXX 820-2955, A1370 820-2855-A, A1465 emc 2558 820-3208, A1465 emc 2631 820-3435, A1465 emc 2924 820-00164, A1304 EMCXXXX 820-2375, A1304 EMCXXXX 820-2375, A1369 emc 2469 820-3023, A1466 emc 259 820-32509, A1466 emc 2632 820-3437, A1466 emc 2925 820-00165, A1466 emc 3178 820-00165, A1425 emc 2512 820-3462, A1502 emc 2678 820-3536, A1502 emc 2678 820-3476, A1502 emc 2875 820-3476, A1502 emc 2835 820-4924, A1398 emc 2512 820-3332, A1398 emc 2673 820-3332, A1398 emc 2746 820-3662, A1398 emc 2876 820-3662, A1398 emc 2745 820-3787, A1398 emc 2881 820-3787, A1398 emc 2909 820-00138, A1398 emc 2910 820-00163, A1398 emc 2910 820-00426, A1708 EMCXXXX 820-00361, A1708 emc 2978 820-00875, A1708 emc 3164 820-00840, A1706 emc 3071 820-00239, A1706 emc 3163 820-00923, A1707 emc 3072 820-00281, A1707 emc 3162 820-00928, A1283 emc 2264 820-2366,A1283 emc 2336 820-XXXX, A1347 emc 2364 820-2577, A1347 emc 2442 820-2993, A1347 emc 2442 820-3059, A1347 emc 2442 820-3017, A1347 emc 2570 820-3227, A1347 emc XXXX 820-3228, A1347 emc 2840 820-5509 

 

In package:

 1pcs x EFI Ribbon cable

1pcs x QFN WSON Socket 6x5

1pcs x QFN WSON Socket 6x8

 

Extra Information:

Details about EFI Ribbon Cable: https://www.ebay.com/itm/133187974519

Details about WSON QFN 6x5: https://www.ebay.com/itm/133798227558

Details about WSON QFN 8x6: https://www.ebay.com/itm/133798207555

 

Shipping time

 You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide) 

Expedited : 5-10 working days  (Europe and Worldwide) 

 

Warranty

This product will have a 30-day warranty.

 

About Us

Chipsetpro.com is a growing tech solutions shop.

Attention !!!  Customs Import Tax

if you are not from Europe, please inquire about customs tax, VAT of your country.

We do not dispatch any products to Russia.

Colombia, Paraguay, Brazil, Mexico - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país

 

SE000028
€68.00

WSON8 QFN8 Socket 6x5

WSON8 QFN8 Socket 6x8

SPI ROM EFI Cable

N16EGTA1 GTX970M

N16E-GT-A1 GTX970M

Part Number N16E-GT-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 105 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000229
€157.54

N16E-GT-A1 GTX970M

A1989 Rom Socket Assistant U2890 Notebook Chip W25Q80DVUXIE Adapter USON 2x3 0.5

Socket of ROM Chip W25Q80DV, size 3x2 U2890

You can read backup and modify of U2890 Rom Chip from 2018 to 2020 Year.

In package:  1pcs x Socket 3x2, 0.5 pitch 

Compatible U2890 for this models:

A2251 820-01949
A2289 820-01987
A2141 820-01700
A2159 820-01598
A1990 820-01041
A1989 820-00850
A1932 820-01521
A2179 820-01958

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000160
€52.00

Rom Socket Adapter Assistant USON 2x3 For U2890 W25Q80DVUXIE 

In package: 1pcs x USON 2x3, 0.5 pitch socket

Compatible:

A2251 820-01949

A2289 820-01987

A2141 820-01700

A2159 820-01598

A1990 820-01041

A1989 820-00850

A1932 820-01521

A2179 820-01958

2160856040

216-0856040

Part Number 216-0856040 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2009

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000233
€20.90

216-0856040

BGA100 BGA64 BGA153 BGA169 Socket Adapter EMMC DDR CPU Flash IC Adapter RT809H

In package included

 

1pcs x BGA64 Socket 

1pcs x frame 11*13 mm, compatible S29GL512 S29GL256 S29GL128 S29GL064 S29GL032

1pcs x frame 10*13 mm, compatible 28F640, 28F128

1pcs x frame 10*15 mm, compatible 28F256

1pcs x frame 9*9

 

1pcs x BGA153/169 Socket 

1pcs x frame 11*10 mm

1pcs x frame 11.5*13 mm 

1pcs x frame 12*16 mm

1pcs x frame 12*18 mm

1pcs x frame 14*18 mm

 

1pcs x BGA100 Socket 

1pcs x frame 14*18 mm

  

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000163
€196.00

BGA64

BGA100

BGA153/169

SR2EU i36100U

SR2EU i3-6100U

Part Number Core i3-6100U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000252
€180.51

SR2EU i3-6100U

2160707001 HD3470

216-0707001 HD3470

Part Number 216-0707001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1004

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000269
€16.54

216-0707001 HD3470

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA100-01 V2.5

1pcs x Frame 14x18

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH001979
€89.00

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

BGA221 Socket Test Adapter EMMC 221 EMCP EMC FBGA Seat RT-BGA221 RT809H Programmer

In package included: 

1pcs x socket RT-BGA221-01 V2.5

1pcs x Frame 11.5x13

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH05437
€85.00

BGA221 Socket EMMC 221 RT-BGA221

NF7050630IA2

NF7050-630I-A2

Part Number NF7050-630I-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000270
€18.05

NF7050-630I-A2

N13PGV2SA2

N13P-GV2-S-A2

Part Number N13P-GV2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000276
€16.38

N13P-GV2-S-A2