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GK208-302-B1

Part Number GK208-302-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1606

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Type: QFN8 MLF8 MLP8 To DIP8
Adapter Model: CNV-QFN8-DIP
Chip Pin Pitch: 1.27mm
Number Of Pins: 8pin
Chip Size (mm): 8x6mm

In Package: 1pcs socket WSON QFN 8x6

Compatible: RT809H, SVOD, TNM

If you need both sockets, please select this web-link https://www.ebay.com/itm/133666692999


Shipping details:
You can select shipping option in checkout:  Economy or Expedited

Economy via Deutsche Post

Expedited - DHL courier / DPD courier

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

216-0857001

Part Number 216-0857001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N12P-LP-A1 GT540M

Part Number N12P-LP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Type: QFN8 MLF8 MLP8 To DIP8
Adapter Model: CNV-QFN8-DIP
Chip Pin Pitch: 1.27mm
Number Of Pins: 8pin
Chip Size (mm): 6x5mm

In Package: 1pcs socket WSON QFN 6x5

Compatible: RT809H, SVOD, TNM

If you need both sockets, please select this web-link https://www.ebay.com/itm/133666692999


Shipping details:
You can select shipping option in checkout:  Economy or Expedited

Economy via Deutsche Post

Expedited - DHL courier / DPD courier

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

EM1200GBB22GV E1-1200

Part Number EM1200GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

EM1200GBB22GV E1-1200 Processor for Laptop AMD E1 BGA413 1.4 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

EDID lcd screen led cable read data chip

Keyword: Lcd Cable Led 2 1 Edid Notebook Screen Code Chip Data Read Driver

<<<<Price For Both Socket's>>>> 

In package included:

1pcs : WSON 6x8

1pcs : WSON 6x5

Compatible with programmer: RT809H, SVOD , TNM, TL866, XGECU

------------------------------------------

Type:QFN8 MLF8 MLP8 To DIP8

Adapter Model: CNV-QFN8-DIP

Chip Pin Pitch:1.27mm 

Number Of Pins: 8 (4x2 Side)

Chip Size (mm): 8x6mm

DIP Pin Header Pitch: 2.54mm

------------------------------------------

Type:QFN8 MLF8 MLP8 To DIP8

Adapter Model: CNV-QFN8-DIP

Chip Pin Pitch:1.27mm 

Number Of Pins: 8 (4x2 Side)

Chip Size (mm): 6x5mm

DIP Pin Header Pitch: 2.54mm

Shipping details:
You can select shipping option in checkout:  Economy or Expedited

Economy via Deutsche Post

Expedited - DHL courier / DPD courier

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

DH82Z97 SR1JJ

Part Number DH82Z97 SR1JJ Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Packing list:

1pcs BGA24 socket

1pcs Frame 5x5 (6x8)

Compatible programmers: SVOD programmer, Willem, TNM, SKYPRO, TL866, TNM, RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013, SuperPro, GZUT XPRO and so on.

Can be supported the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 5x5 size of the standards

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.