• Show Sidebar

There are 8 products.

Active filters

  • Categories: Laptop Parts, Repair tool
  • Availability: Not available

250K PMTC 045mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.45mm BGA No Pb/Lead Free Solder Balls

Part Number 0.45mm BGA Solder Balls Manufacturer PMTC

BGA Alloy Sn96.5/Ag3/Cu0.5 Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000938
€20.51

250K PMTC 0.45mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

25K Qwin 040mm BGA Leaded Solder Balls

25K Qwin 0.40mm BGA Leaded Solder Balls

Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin

BGA Alloy Sn63/Pb37 Date Code 19+

Package/Case 25K Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001078
€3.11

25K Qwin 0.40mm BGA Leaded Solder Balls

250K PMTC 055mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.55mm BGA No Pb/Lead Free Solder Balls

Part Number 0.55mm BGA Solder Balls Manufacturer PMTC

BGA Alloy Sn96.5/Ag3/Cu0.5 Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001086
€29.71

250K PMTC 0.55mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

250K PMTC 035mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.35mm BGA No Pb/Lead Free Solder Balls

Part Number 0.35mm BGA Solder Balls Manufacturer PMTC

BGA Alloy No Pb/Lead Free Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001122
€20.51

250K PMTC 0.35mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

10g Japan goot BS10 BGA Reballing repair Flux paste

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001158
€5.35

10g Japan goot BS-10 BGA Reballing repair Flux paste

HDD Open repair data recovery tool seagate 2535 HARD DRIVE HEAD SWAP TOOLS 96pcs kits

HDD Open repair&data recovery tool: * Use Tutorials Video

HD HPE PRO: A Must-Have hardware level of disk repair and data recovery equipment, which enables you an easy and exact drive disassembling and HEAD stack/Platter exchange.

Main Features: Easy to use; Universal-fit workbench; Pioneer platter exchanger; change multiple platters without moving the platters out of alignment with each other; Special Actuator Remover with strong magnetism works (removal, installation) easily on the upper magnet of the actuator.

Highlights:

Universal-fit workbench assures you to operate on your HD on a relatively stable table, making your job easier and more reliable.

Pioneer platter exchanger maintains the original cylinder status by removing and placing each platter of the multiple platters together, so that allows you to change multiple platters without moving the platters out of alignment with each other which otherwise will result in data corruption.

Special Actuator Remover assures you to perform easy operation (removal, installation) on the upper magnet of the actuator which is very hard to be removed and put back because of its strong magnetism and it's sensitive and embarrassed position (being very close to both the Head Stack and Media Platter), in case it slips out and touch either of its fragile neighbors during the operations - the consequences will be a disaster.

Packing List:

1.Universal-fit Workbench -1pc;

2.Multiple Platter Exchanger -4pcs;

3.Stable Actuator Exchanger -1pc;

4.Replacement tools for 2.5 inch disk -1pc

5.Replacement tools for 3.5 inch disk -1pc

6.Tool 96pcs kits

CH003337
€231.24

HDD Open repair data recovery tool seagate 2.5-3.5+ HARD DRIVE HEAD SWAP TOOLS 96pcs kits

250K PMTC 045mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.45mm BGA No Pb/Lead Free Solder Balls

Part Number 0.45mm BGA Solder Balls Manufacturer PMTC

BGA Alloy Sn96.5/Ag3/Cu0.5 Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000938
€20.51

250K PMTC 0.45mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

25K Qwin 040mm BGA Leaded Solder Balls

25K Qwin 0.40mm BGA Leaded Solder Balls

Part Number 0.40mm BGA Leaded Solder Balls Manufacturer Qwin

BGA Alloy Sn63/Pb37 Date Code 19+

Package/Case 25K Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001078
€3.11

25K Qwin 0.40mm BGA Leaded Solder Balls

250K PMTC 055mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.55mm BGA No Pb/Lead Free Solder Balls

Part Number 0.55mm BGA Solder Balls Manufacturer PMTC

BGA Alloy Sn96.5/Ag3/Cu0.5 Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001086
€29.71

250K PMTC 0.55mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

250K PMTC 035mm Sn965Ag3Cu05 BGA No PbLead Free Solder Balls

250K PMTC 0.35mm BGA No Pb/Lead Free Solder Balls

Part Number 0.35mm BGA Solder Balls Manufacturer PMTC

BGA Alloy No Pb/Lead Free Date Code 19+

Package/Case 250K Description Brand New

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001122
€20.51

250K PMTC 0.35mm Sn96.5/Ag3/Cu0.5 BGA No Pb/Lead Free Solder Balls

10g Japan goot BS10 BGA Reballing repair Flux paste

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001158
€5.35

10g Japan goot BS-10 BGA Reballing repair Flux paste

HDD Open repair data recovery tool seagate 2535 HARD DRIVE HEAD SWAP TOOLS 96pcs kits

HDD Open repair&data recovery tool: * Use Tutorials Video

HD HPE PRO: A Must-Have hardware level of disk repair and data recovery equipment, which enables you an easy and exact drive disassembling and HEAD stack/Platter exchange.

Main Features: Easy to use; Universal-fit workbench; Pioneer platter exchanger; change multiple platters without moving the platters out of alignment with each other; Special Actuator Remover with strong magnetism works (removal, installation) easily on the upper magnet of the actuator.

Highlights:

Universal-fit workbench assures you to operate on your HD on a relatively stable table, making your job easier and more reliable.

Pioneer platter exchanger maintains the original cylinder status by removing and placing each platter of the multiple platters together, so that allows you to change multiple platters without moving the platters out of alignment with each other which otherwise will result in data corruption.

Special Actuator Remover assures you to perform easy operation (removal, installation) on the upper magnet of the actuator which is very hard to be removed and put back because of its strong magnetism and it's sensitive and embarrassed position (being very close to both the Head Stack and Media Platter), in case it slips out and touch either of its fragile neighbors during the operations - the consequences will be a disaster.

Packing List:

1.Universal-fit Workbench -1pc;

2.Multiple Platter Exchanger -4pcs;

3.Stable Actuator Exchanger -1pc;

4.Replacement tools for 2.5 inch disk -1pc

5.Replacement tools for 3.5 inch disk -1pc

6.Tool 96pcs kits

CH003337
€231.24

HDD Open repair data recovery tool seagate 2.5-3.5+ HARD DRIVE HEAD SWAP TOOLS 96pcs kits