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In package included:

TSOP48 DIP48 0.5 Socket x 1 pcs 

Please to select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect  - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Battery for Lenovo G530 G450 G550 G555 V570 (11.1V 4400mAh) p/n: L08S6Y02 L08L6Y02 L08N6Y02

Battery Type Li-ion Product Type Replacement Battery

Voltage 11.1V Color Black

Capacity 4400mAh Description New OEM

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

In package include: 

1 PCS  - JTAG SOIC8 DIP SILICONE CABLE WITH GOLD 8 PINS 

You can select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Technical information:

SOIC 8pin , 208mm, 1,27mm

SST 25VF064C 

Chip width: 5.18-5.38mm

Chip length: 7.08-7.34mm

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VSOP 8pin, 208mm, 1,27mm

Winbond W25Q32FV 

Chip width (E1): 5.18-5.28mm

Chip length (D): 5.18-5.28mm

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You can used GOLD PIN SILICONE CABLE and read this bios chip (visit our shop and check)

Apple Macbook Pro A1286 M98_820-2330-A_G96-632-C1_SST25VF032B - support GOLDEN pin silicone cable. 

Apple A1278 K6 MCP89MZ-A2 SST25VF032B -  EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Imac 27 A1312 820-2828-A_MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1370 820-2855-A MX25L6406D

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MacBook Pro A1297 820-2914-B-MX25L6406E -  (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1278-820-2936-B-MXIC MX25L6406E - (support only GOLDEN PIN silicone cable)

Apple A1466 820-3209-A Apple MX25L6406E-1.820-3209-A

Apple MacBook Air A1369 2011-820-3023-A-MX25L6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Pro Retina 13" A1425 820-3462-A 2012 Year MX25L6406E

Apple MacBook Pro 13" A1278 820-3115-B MD101 MX25L6406E  - (support only GOLDEN PIN silicone cable)

Apple MacBook Pro Retina 13" A1502 Late 2013 Mid 2014 820-3476-A 4G 8G MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MAC Mini A1347 820-3228-A mx25l6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

----------------------------------------

Information for customer / Información para el cliente:
if you are not from Europe, please inquire about customs tax, VAT of your country.
We do not ship products in Russia.
Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Newest XPROG-M V5.5.5 X-PROG M BOX V5.55 ECU Programmer Especially for BMW CAS4 Decryption

XPROG-M V5.5.5 X-PROG software

Login to Download: Download software

Install Notice

XPROG-M Windows system required as below:

1. Windows system should be windows7 64 bit, all the patch software for the windows system should be installed already and the windows properly works well...

2. The windows system should be with at lest 2 partitions (except the CD ROM.)

3. Can not be working with virtual harddisk.

Top 5 Reasons to Get Newest XPROG-M V5.5.5:

1. This is the only version XPROG-M can decypte new version BMW CAS4.

2. Add new authorization: AUTH-0025 Authorized 11/4/2014

3. Latest software version: V5.5.5

4. High quality with one year warranty.

XPROG-M V5.5.5 Authorizations:

AUTH-0001 Motorola HC05 family authorization (allows to read/write EEPROM)

AUTH-0002 Motorola HC08 family authorization (allows to read/write EEPROM)

AUTH-0003 Motorola HC11 family authorization (allows to read/write EEPROM)

AUTH-0004 Motorola HC12, 9S12 family authorization (allows to read/write EEPROM and flash memory)

AUTH-0005 Texas Instruments TMS370/TMS374 family authorization (allows to read/write EEPROM)

AUTH-0006 Motorola HC05Bxx and HC05Xxx family bypass security authorization (allows to read/write secured EEPROM and flash memory)

AUTH-0007 ST M35080 authorization. Read/Write/Erase device to delivery state.

AUTH-0008 BMW EWS3 authorization

AUTH-0009 ATMEGA family authorization (allows to read/write EEPROM and flash memory)

AUTH-0010 MB ZGS001 authorization

AUTH-0011 Motorola HC11EA9/E9 bypass security authorization (allows to bypass security bit and read EEPROM and RAM memory)

AUTH-0012 National CR16 authorization (allows to read/write EEPROM memory)

AUTH-0014 ST7, ST10 family authorization (allows to read/write internal flash)

AUTH-0015 MPC5xx authorization (depending on device program automatically detects MPC5xx, M95xxx device type, flash, external flash and configuration memory size)

AUTH-0018 Motorola HC12, HC912, MC9S12, MC9S12X bypass security authorization (allows to read/write secured EEPROM and flash memory)

AUTH-0020 ARM (Micronas, ...) Family authorization (allows to read/write internal flash and external serial EEPROM)

AUTH-0021 ARM (Micronas, ...) Family bypass security authorization (allows to read/write secured and non-secured internal flash and external serial EEPROM, view/change mileage,chassis number (VIN), serial number and PIN code).

AUTH-0023-1 MAC7xxx

AUTH-0023-2 XC23xx

AUTH-0024-1 MC9S12Cxx

AUTH-0024-2 MC9S12XE

AUTH-0024-3 9S12XE SECURITY

AUTH-0024-4 MC9S12HA/HY/P

AUTH-0025-1 MPC/SPC5xxx Authorized 11/4/2014

XPROG-M V5.5.5 Adapters:

ADP-0001 TMS370 PLCC28 programming adapter

ADP-0002 TMS370 PLCC44 programming adapter

ADP-0003 TMS370 PLCC68 programming adapter

ADP-0004 Motorola HC05B/X PLCC52 programming adapter

ADP-0005 Motorola HC05B/X QFP64 programming adapter

ADP-0006 ST M35080 in-circuit programming adapter

ADP-0008 TMS374 family in-circuit programming adapter

ADP-0009 MC68HC05V12 programming adapter

ADP-0010 TMS374 on-board programming adapter

ADP-0011 HC11EA9/E9 programming adapter

ADP-0017 HC(S)12 BDM / ARM Micronas in-circuit programming/bypass security adapter

Additional adaptor for 5M48H P-Flash

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

T13-D24 BaKon integrated heating core lead-free portable 75W constant temperature soldering iron core

1.TSOP32/40/48 Base Board

2.TSOP32/40/48 Socket Soldering top Board

3.TSOP48/SOP44 ZIF Socket top Board

4.TSOP40A Base Board,

5.TSOP40B Base Board,

6.TSOP32/40/48 Soldering top Board

T13-BC2 BaKon integrated heating core lead-free portable 75W constant temperature soldering iron core

N3150 SR29F Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N15E-GX-A2 Stencil Template 90*90

3.0mm Blue GPU CPU Heatsink Silicone Compound Thermal Conductive Pad

Part Number Compound Thermal Conductive Pad Manufacturer ZTK

Ingredients Silicone Date Code 16+

Size 100*100*3.0 Description Bulk new