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  • Categories: BGA Soldering Preheating Station
  • Categories: Other BGA Chips & ICs
  • Categories: PCI, CPU Socket Tester
  • Categories: Programmer Spare Part
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RICHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
€3.45

RICHTEK RT8809B 08=

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Laptop Motherboard DDR4 RAM Memory Slot LED Diagnostic Analyzer Tester Card

Product Information

Laptop Motherboard DDR4 RAM Memory Slot Diagnostic Analyzer Tester Card with LED

Item Condition:

New

Part Description:

1pcs * DDR4 DDR 4 RAM Memory Slot Tester With LED Indicator

Part Number:

DDR4 RAM Tester Card Support for All of Inter and AMD Memory Slot

Part Info1:

Size: 68 x 40 x 28mm

Part Info2:

Checking open or short circuit or data line

Part Info3:

* Excluded 3.3V CR2032 Battery

Product Weight:

15g

Product Content

Laptop Mainboard Board DDR4 RAM Memory Slot tester.

Through the process of starting up and read the RAM Memory, could indicate the faults in the mother board circuit for further repairing.

The fault could be reflected by the LED light, indicating open circuit or short circuit or data line and address line.

Usage:

Install the 3.3v (CR2032) battery on the tester, mainboard need not power on, press the button of the tester.

If the LEDs all light on and the brightness are all the same, the signal is all right ,there is no problem.

No light Or weak light signal there is problem, you should refer to sign indication beside that LED light.

CH000921
€13.55

Laptop Motherboard DDR4 RAM Memory Slot /LED Diagnostic Analyzer Tester Card

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FUJITSU MB3887

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
€3.45

FUJITSU MB3887

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RALINK RT3050F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
€3.45

RALINK RT3050F

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NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
€3.45

NT71209FG-810

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

The two generation, the three generation, the five generation, AMD638, 989, MIN, DDR3, DDR4

Login to Download: * User Manual Download

CH000414
€69.00

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

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RICHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
€3.45

RICHTEK RT8809B 08=

wishlist
Compare

Laptop Motherboard DDR4 RAM Memory Slot LED Diagnostic Analyzer Tester Card

Product Information

Laptop Motherboard DDR4 RAM Memory Slot Diagnostic Analyzer Tester Card with LED

Item Condition:

New

Part Description:

1pcs * DDR4 DDR 4 RAM Memory Slot Tester With LED Indicator

Part Number:

DDR4 RAM Tester Card Support for All of Inter and AMD Memory Slot

Part Info1:

Size: 68 x 40 x 28mm

Part Info2:

Checking open or short circuit or data line

Part Info3:

* Excluded 3.3V CR2032 Battery

Product Weight:

15g

Product Content

Laptop Mainboard Board DDR4 RAM Memory Slot tester.

Through the process of starting up and read the RAM Memory, could indicate the faults in the mother board circuit for further repairing.

The fault could be reflected by the LED light, indicating open circuit or short circuit or data line and address line.

Usage:

Install the 3.3v (CR2032) battery on the tester, mainboard need not power on, press the button of the tester.

If the LEDs all light on and the brightness are all the same, the signal is all right ,there is no problem.

No light Or weak light signal there is problem, you should refer to sign indication beside that LED light.

CH000921
€13.55

Laptop Motherboard DDR4 RAM Memory Slot /LED Diagnostic Analyzer Tester Card

wishlist
Compare

FUJITSU MB3887

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
€3.45

FUJITSU MB3887

wishlist
Compare

RALINK RT3050F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
€3.45

RALINK RT3050F

wishlist
Compare

NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
€3.45

NT71209FG-810

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