Home

GK208-302-B1

Part Number GK208-302-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1606

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

In package included:

TSOP48 DIP48 0.5 Socket x 1 pcs 

Please to select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect  - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

Newest XPROG-M V5.5.5 X-PROG M BOX V5.55 ECU Programmer Especially for BMW CAS4 Decryption

XPROG-M V5.5.5 X-PROG software

Login to Download: Download software

Install Notice

XPROG-M Windows system required as below:

1. Windows system should be windows7 64 bit, all the patch software for the windows system should be installed already and the windows properly works well...

2. The windows system should be with at lest 2 partitions (except the CD ROM.)

3. Can not be working with virtual harddisk.

Top 5 Reasons to Get Newest XPROG-M V5.5.5:

1. This is the only version XPROG-M can decypte new version BMW CAS4.

2. Add new authorization: AUTH-0025 Authorized 11/4/2014

3. Latest software version: V5.5.5

4. High quality with one year warranty.

XPROG-M V5.5.5 Authorizations:

AUTH-0001 Motorola HC05 family authorization (allows to read/write EEPROM)

AUTH-0002 Motorola HC08 family authorization (allows to read/write EEPROM)

AUTH-0003 Motorola HC11 family authorization (allows to read/write EEPROM)

AUTH-0004 Motorola HC12, 9S12 family authorization (allows to read/write EEPROM and flash memory)

AUTH-0005 Texas Instruments TMS370/TMS374 family authorization (allows to read/write EEPROM)

AUTH-0006 Motorola HC05Bxx and HC05Xxx family bypass security authorization (allows to read/write secured EEPROM and flash memory)

AUTH-0007 ST M35080 authorization. Read/Write/Erase device to delivery state.

AUTH-0008 BMW EWS3 authorization

AUTH-0009 ATMEGA family authorization (allows to read/write EEPROM and flash memory)

AUTH-0010 MB ZGS001 authorization

AUTH-0011 Motorola HC11EA9/E9 bypass security authorization (allows to bypass security bit and read EEPROM and RAM memory)

AUTH-0012 National CR16 authorization (allows to read/write EEPROM memory)

AUTH-0014 ST7, ST10 family authorization (allows to read/write internal flash)

AUTH-0015 MPC5xx authorization (depending on device program automatically detects MPC5xx, M95xxx device type, flash, external flash and configuration memory size)

AUTH-0018 Motorola HC12, HC912, MC9S12, MC9S12X bypass security authorization (allows to read/write secured EEPROM and flash memory)

AUTH-0020 ARM (Micronas, ...) Family authorization (allows to read/write internal flash and external serial EEPROM)

AUTH-0021 ARM (Micronas, ...) Family bypass security authorization (allows to read/write secured and non-secured internal flash and external serial EEPROM, view/change mileage,chassis number (VIN), serial number and PIN code).

AUTH-0023-1 MAC7xxx

AUTH-0023-2 XC23xx

AUTH-0024-1 MC9S12Cxx

AUTH-0024-2 MC9S12XE

AUTH-0024-3 9S12XE SECURITY

AUTH-0024-4 MC9S12HA/HY/P

AUTH-0025-1 MPC/SPC5xxx Authorized 11/4/2014

XPROG-M V5.5.5 Adapters:

ADP-0001 TMS370 PLCC28 programming adapter

ADP-0002 TMS370 PLCC44 programming adapter

ADP-0003 TMS370 PLCC68 programming adapter

ADP-0004 Motorola HC05B/X PLCC52 programming adapter

ADP-0005 Motorola HC05B/X QFP64 programming adapter

ADP-0006 ST M35080 in-circuit programming adapter

ADP-0008 TMS374 family in-circuit programming adapter

ADP-0009 MC68HC05V12 programming adapter

ADP-0010 TMS374 on-board programming adapter

ADP-0011 HC11EA9/E9 programming adapter

ADP-0017 HC(S)12 BDM / ARM Micronas in-circuit programming/bypass security adapter

Additional adaptor for 5M48H P-Flash

216-0857001

Part Number 216-0857001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

1.TSOP32/40/48 Base Board

2.TSOP32/40/48 Socket Soldering top Board

3.TSOP48/SOP44 ZIF Socket top Board

4.TSOP40A Base Board,

5.TSOP40B Base Board,

6.TSOP32/40/48 Soldering top Board

N12P-LP-A1 GT540M

Part Number N12P-LP-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1341

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

EM1200GBB22GV E1-1200

Part Number EM1200GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

EM1200GBB22GV E1-1200 Processor for Laptop AMD E1 BGA413 1.4 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

1 packing 40pin 200pcs Sockets SIL 2.54mm Pitch

DH82Z97 SR1JJ

Part Number DH82Z97 SR1JJ Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX2084 Adapter for XELTEK SuperPro 6100N

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include:

1* EZP2013 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter