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GF114400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000169
€5.47

GF114-400-A1 Stencil Template

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2160810028 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005258
€9.97

216-0810028 Stencil Template 90*90

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Osram LEDs - SMD Yellow 590 nm 3528 PLCC6 Tail Light

  • Product: Yellow LEDs
  • Mounting Style: SMD/SMT
  • Package/Case: PLCC-6
  • Illumination Colour: Yellow
  • Wavelength/Colour Temperature: 590 nm
  • Luminous Intensity: 2.8 cd
  • Luminous Flux/Radiant Flux: 9.5 lm
  • Lens Colour/Style: Water Clear
  • If - Forward Current: 140 mA
  • Vf - Forward Voltage: 2.2 V
  • Power Rating: 1 W
  • Length: 3.2 mm
  • Width: 3 mm
  • Height: 1.9 mm
  • Minimum Operating Temperature: - 40 C
  • Maximum Operating Temperature: + 110 C
  • Series: Advanced Power TOPLED
  • Brand: OSRAM Opto Semiconductors
  • LED Size: 3.2 mm x 3 mm x 1.9 mm
  • Lens Shape: Round Flat
  • Viewing Angle: 120 deg
LD000007
€0.33
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N3150 SR29F Stencil Template

N3150 SR29F Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000173
€6.22

N3150 SR29F Stencil Template

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2160774008 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000177
€5.40

216-0774008 Stencil Template

Vehicle Diagnostic Scanner Golo Master 2.0 OBD2 Interface

Vehicle Diagnostics Interface Golo 2.0
Condition: USED, Worked perfect
In packing included: 
1. Diagnostic adapter Golo OBD-II
2. OBD-II cover
3. OBD-II extension adapter
Full System Scan
GO000001
€199.00
1. Diagnostic adapter Golo OBD-II
2. OBD-II cover
3. OBD-II extension adapter
4. Packing
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GF114400A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000169
€5.47

GF114-400-A1 Stencil Template

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Compare

2160810028 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH005258
€9.97

216-0810028 Stencil Template 90*90

wishlist
Compare

Osram LEDs - SMD Yellow 590 nm 3528 PLCC6 Tail Light

  • Product: Yellow LEDs
  • Mounting Style: SMD/SMT
  • Package/Case: PLCC-6
  • Illumination Colour: Yellow
  • Wavelength/Colour Temperature: 590 nm
  • Luminous Intensity: 2.8 cd
  • Luminous Flux/Radiant Flux: 9.5 lm
  • Lens Colour/Style: Water Clear
  • If - Forward Current: 140 mA
  • Vf - Forward Voltage: 2.2 V
  • Power Rating: 1 W
  • Length: 3.2 mm
  • Width: 3 mm
  • Height: 1.9 mm
  • Minimum Operating Temperature: - 40 C
  • Maximum Operating Temperature: + 110 C
  • Series: Advanced Power TOPLED
  • Brand: OSRAM Opto Semiconductors
  • LED Size: 3.2 mm x 3 mm x 1.9 mm
  • Lens Shape: Round Flat
  • Viewing Angle: 120 deg
LD000007
€0.33
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N3150 SR29F Stencil Template

N3150 SR29F Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000173
€6.22

N3150 SR29F Stencil Template

wishlist
Compare

2160774008 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000177
€5.40

216-0774008 Stencil Template

wishlist
Compare
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