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  • Categories: PCI, CPU Socket Tester
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Gold PIN VSOP SOIC 208mil Ribbon cable bios spi rom jtag flashing backup 8pin spi25 flash

In package include: 

1 PCS  - JTAG SOIC8 DIP SILICONE CABLE WITH GOLD 8 PINS 

You can select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Technical information:

SOIC 8pin , 208mm, 1,27mm

SST 25VF064C 

Chip width: 5.18-5.38mm

Chip length: 7.08-7.34mm

---------------------------------------

VSOP 8pin, 208mm, 1,27mm

Winbond W25Q32FV 

Chip width (E1): 5.18-5.28mm

Chip length (D): 5.18-5.28mm

----------------------------------------

You can used GOLD PIN SILICONE CABLE and read this bios chip (visit our shop and check)

Apple Macbook Pro A1286 M98_820-2330-A_G96-632-C1_SST25VF032B - support GOLDEN pin silicone cable. 

Apple A1278 K6 MCP89MZ-A2 SST25VF032B -  EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Imac 27 A1312 820-2828-A_MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1370 820-2855-A MX25L6406D

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MacBook Pro A1297 820-2914-B-MX25L6406E -  (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1278-820-2936-B-MXIC MX25L6406E - (support only GOLDEN PIN silicone cable)

Apple A1466 820-3209-A Apple MX25L6406E-1.820-3209-A

Apple MacBook Air A1369 2011-820-3023-A-MX25L6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Pro Retina 13" A1425 820-3462-A 2012 Year MX25L6406E

Apple MacBook Pro 13" A1278 820-3115-B MD101 MX25L6406E  - (support only GOLDEN PIN silicone cable)

Apple MacBook Pro Retina 13" A1502 Late 2013 Mid 2014 820-3476-A 4G 8G MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MAC Mini A1347 820-3228-A mx25l6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

----------------------------------------

Information for customer / Información para el cliente:
if you are not from Europe, please inquire about customs tax, VAT of your country.
We do not ship products in Russia.
Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000140
€52.88

Soic8, Vsop8 208mil Pin Holder, bios reflashing gold pin cable spi25 flash

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RICHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
€3.45

RICHTEK RT8809B 08=

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Laptop Motherboard DDR4 RAM Memory Slot LED Diagnostic Analyzer Tester Card

Product Information

Laptop Motherboard DDR4 RAM Memory Slot Diagnostic Analyzer Tester Card with LED

Item Condition:

New

Part Description:

1pcs * DDR4 DDR 4 RAM Memory Slot Tester With LED Indicator

Part Number:

DDR4 RAM Tester Card Support for All of Inter and AMD Memory Slot

Part Info1:

Size: 68 x 40 x 28mm

Part Info2:

Checking open or short circuit or data line

Part Info3:

* Excluded 3.3V CR2032 Battery

Product Weight:

15g

Product Content

Laptop Mainboard Board DDR4 RAM Memory Slot tester.

Through the process of starting up and read the RAM Memory, could indicate the faults in the mother board circuit for further repairing.

The fault could be reflected by the LED light, indicating open circuit or short circuit or data line and address line.

Usage:

Install the 3.3v (CR2032) battery on the tester, mainboard need not power on, press the button of the tester.

If the LEDs all light on and the brightness are all the same, the signal is all right ,there is no problem.

No light Or weak light signal there is problem, you should refer to sign indication beside that LED light.

CH000921
€13.55

Laptop Motherboard DDR4 RAM Memory Slot /LED Diagnostic Analyzer Tester Card

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FUJITSU MB3887

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
€3.45

FUJITSU MB3887

wishlist
Compare
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RALINK RT3050F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
€3.45

RALINK RT3050F

wishlist
Compare
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NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
€3.45

NT71209FG-810

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INTEL LE82GME965 SLA9F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
€22.24

INTEL LE82GME965 SLA9F

Gold PIN VSOP SOIC 208mil Ribbon cable bios spi rom jtag flashing backup 8pin spi25 flash

In package include: 

1 PCS  - JTAG SOIC8 DIP SILICONE CABLE WITH GOLD 8 PINS 

You can select shipping option in checkout:

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

Technical information:

SOIC 8pin , 208mm, 1,27mm

SST 25VF064C 

Chip width: 5.18-5.38mm

Chip length: 7.08-7.34mm

---------------------------------------

VSOP 8pin, 208mm, 1,27mm

Winbond W25Q32FV 

Chip width (E1): 5.18-5.28mm

Chip length (D): 5.18-5.28mm

----------------------------------------

You can used GOLD PIN SILICONE CABLE and read this bios chip (visit our shop and check)

Apple Macbook Pro A1286 M98_820-2330-A_G96-632-C1_SST25VF032B - support GOLDEN pin silicone cable. 

Apple A1278 K6 MCP89MZ-A2 SST25VF032B -  EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Imac 27 A1312 820-2828-A_MX25L6406E - EFI ribbon cable not compatible (support only GOLDEN PIN silicone cable)

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1370 820-2855-A MX25L6406D

Apple Macbook Air A1370 820-2855-A MX25L6406D

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MacBook Pro A1297 820-2914-B-MX25L6406E -  (support only GOLDEN PIN silicone cable)

Apple MacBook Pro A1278-820-2936-B-MXIC MX25L6406E - (support only GOLDEN PIN silicone cable)

Apple A1466 820-3209-A Apple MX25L6406E-1.820-3209-A

Apple MacBook Air A1369 2011-820-3023-A-MX25L6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Pro Retina 13" A1425 820-3462-A 2012 Year MX25L6406E

Apple MacBook Pro 13" A1278 820-3115-B MD101 MX25L6406E  - (support only GOLDEN PIN silicone cable)

Apple MacBook Pro Retina 13" A1502 Late 2013 Mid 2014 820-3476-A 4G 8G MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

Apple A1502 051-0052 820-3536 MX25L6406E

Apple MAC Mini A1347 820-3228-A mx25l6406E

Apple MacBook Air 11" 2012 A1465 820-3208-A 2012 MX25L6406E

Apple MacBook Air 11" A1465 820-3435-A 13"A1466 820-3437-A 2013 2014 2015 MX25L6406E

----------------------------------------

Information for customer / Información para el cliente:
if you are not from Europe, please inquire about customs tax, VAT of your country.
We do not ship products in Russia.
Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000140
€52.88

Soic8, Vsop8 208mil Pin Holder, bios reflashing gold pin cable spi25 flash

wishlist
Compare

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

The two generation, the three generation, the five generation, AMD638, 989, MIN, DDR3, DDR4

Login to Download: * User Manual Download

CH000414
€69.00

FULL SET OF CPU SOCKET TESTER FOR LAPTOP

wishlist
Compare

RICHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
€3.45

RICHTEK RT8809B 08=

wishlist
Compare

Laptop Motherboard DDR4 RAM Memory Slot LED Diagnostic Analyzer Tester Card

Product Information

Laptop Motherboard DDR4 RAM Memory Slot Diagnostic Analyzer Tester Card with LED

Item Condition:

New

Part Description:

1pcs * DDR4 DDR 4 RAM Memory Slot Tester With LED Indicator

Part Number:

DDR4 RAM Tester Card Support for All of Inter and AMD Memory Slot

Part Info1:

Size: 68 x 40 x 28mm

Part Info2:

Checking open or short circuit or data line

Part Info3:

* Excluded 3.3V CR2032 Battery

Product Weight:

15g

Product Content

Laptop Mainboard Board DDR4 RAM Memory Slot tester.

Through the process of starting up and read the RAM Memory, could indicate the faults in the mother board circuit for further repairing.

The fault could be reflected by the LED light, indicating open circuit or short circuit or data line and address line.

Usage:

Install the 3.3v (CR2032) battery on the tester, mainboard need not power on, press the button of the tester.

If the LEDs all light on and the brightness are all the same, the signal is all right ,there is no problem.

No light Or weak light signal there is problem, you should refer to sign indication beside that LED light.

CH000921
€13.55

Laptop Motherboard DDR4 RAM Memory Slot /LED Diagnostic Analyzer Tester Card

wishlist
Compare

FUJITSU MB3887

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
€3.45

FUJITSU MB3887

wishlist
Compare

RALINK RT3050F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
€3.45

RALINK RT3050F

wishlist
Compare

NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
€3.45

NT71209FG-810

wishlist
Compare

INTEL LE82GME965 SLA9F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
€22.24

INTEL LE82GME965 SLA9F

wishlist
Compare
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