Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
16 other products in the same category
GTX970M N16EGTA1 Stencil Template 90x90
GTX970M N16E-GT-A1 Stencil Template 90*90
i53427U SR0N7 Stencil Template 90x90
i5-3427U SR0N7 Stencil Template 90*90
i76500U SR2EZ Stencil Template 90x90
i7-6500U SR2EZ Stencil Template 90*90
Pentium DualCore Mobile 987 SR0V4 Stencil Template
Pentium Dual-Core Mobile 987 SR0V4 Stencil Template
SR0FB Pentium DualCore Mobile Stencil Template 90x90
SR0FB Pentium Dual-Core Mobile Stencil Template 90*90
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template
SR17E SR17C SR17D SR13J SR13H DH82HM86 DH82HM87 Stencil Template