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  • Kategorie: BGA Chips & IC
  • Kategorie: Laptop Parts (ang.), Repair tool
  • Kategorie: Obsługa
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Osram LED – SMD Yellow 590 nm 3528 PLCC6 (ang.)

  • Product: Yellow LEDs
  • Mounting Style: SMD/SMT
  • Package/Case: PLCC-6
  • Illumination Colour: Yellow
  • Wavelength/Colour Temperature: 590 nm
  • Luminous Intensity: 2.8 cd
  • Luminous Flux/Radiant Flux: 9.5 lm
  • Lens Colour/Style: Water Clear
  • If - Forward Current: 140 mA
  • Vf - Forward Voltage: 2.2 V
  • Power Rating: 1 W
  • Length: 3.2 mm
  • Width: 3 mm
  • Height: 1.9 mm
  • Minimum Operating Temperature: - 40 C
  • Maximum Operating Temperature: + 110 C
  • Series: Advanced Power TOPLED
  • Brand: OSRAM Opto Semiconductors
  • LED Size: 3.2 mm x 3 mm x 1.9 mm
  • Lens Shape: Round Flat
  • Viewing Angle: 120 deg
LD000007
0,33 €
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RCHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
3,45 €

RT8809B 08=08

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FUJITSU MB3887 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
3,45 €

FUJITSU MB3887 (ANG.)

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RALINK RT3050F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
3,45 €

RALINK RT3050F (ANG.)

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NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
3,45 €

NT71209FG-810

Scanner Golo Master 2.0 OBD2 (ang.) Interface

Vehicle Diagnostics Interface Golo 2.0
Condition: USED, Worked perfect
In packing included: 
1. Diagnostic adapter Golo OBD-II
2. OBD-II cover
3. OBD-II extension adapter
Full System Scan
GO000001
199,00 €
1. Golo OBD-II (ang.)
Okładka 2
3. adapter OBD-II
pakiet 4
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Osram LED – SMD Yellow 590 nm 3528 PLCC6 (ang.)

  • Product: Yellow LEDs
  • Mounting Style: SMD/SMT
  • Package/Case: PLCC-6
  • Illumination Colour: Yellow
  • Wavelength/Colour Temperature: 590 nm
  • Luminous Intensity: 2.8 cd
  • Luminous Flux/Radiant Flux: 9.5 lm
  • Lens Colour/Style: Water Clear
  • If - Forward Current: 140 mA
  • Vf - Forward Voltage: 2.2 V
  • Power Rating: 1 W
  • Length: 3.2 mm
  • Width: 3 mm
  • Height: 1.9 mm
  • Minimum Operating Temperature: - 40 C
  • Maximum Operating Temperature: + 110 C
  • Series: Advanced Power TOPLED
  • Brand: OSRAM Opto Semiconductors
  • LED Size: 3.2 mm x 3 mm x 1.9 mm
  • Lens Shape: Round Flat
  • Viewing Angle: 120 deg
LD000007
0,33 €
wishlist
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RCHTEK RT8809B 08

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000187
3,45 €

RT8809B 08=08

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Compare

FUJITSU MB3887 (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000190
3,45 €

FUJITSU MB3887 (ANG.)

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30 mm Blue GPU Heatsink Silicone Compound (ang.)

3.0mm Blue GPU CPU Heatsink Silicone Compound Thermal Conductive Pad

Part Number Compound Thermal Conductive Pad Manufacturer ZTK

Ingredients Silicone Date Code 16+

Size 100*100*3.0 Description Bulk new

CH000183
2,70 €

procesor Blue GPU Heatsink Silicone Compound

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RALINK RT3050F (ANG.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
3,45 €

RALINK RT3050F (ANG.)

wishlist
Compare

NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
3,45 €

NT71209FG-810

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