Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours
Pay attention to the difference between
leaded (Pb) balls and lead free (No Pb) balls.
Lead-free/No Pb BGA chips:
245C-260C(Maximun)
Leaded/Pb BGA chips:
180C-205C(Maximun)
Sufficient Stock
No customer reviews for the moment.
LVDS Cable for screen Lenovo B570 B575 V570 P/N: 50.4lH07.002 50.4IH07.002 50.4IH07.032
SIEMENS 7MH4930-0AA01 MS Electronic Weighing Module
Silicone Heat Mat Repair Insulation Kit Mobile Computer Tablets Phones Fix Pad 34*23cm
FPC FFC flat cable connector socket 32pin 1.0mm Pitch for Laptop keyboard interface
ASUS X99 BGA2084 PC Connector Foxconn Socket LGA2011-3 CPU Base
LVDS Cable for screen Acer E5-522 E5-532 E5-574 p/n: DD0ZRTLC100 DD0ZRTLC110 DD0ZRTLC120 DD0ZRT
Laptop Motherboard Socket 754M Base BGA
Foxconn H3 Socket LGA1150 CPU Base 1150 PC Connector BGA Base
LVDS Cable for screen HP 15-e000 p/n: DD0R65LC00
HP 4535S 4730S 8460P 8450p 8460p 6460b 6470B 8460W 4530S CPU cooling fan 646285-001 641839-001
VETUS ESD-10 Safe Anti-Static Stainless Steel Tweezers Maintenance Repair Tools
Surface Pro-4 Samsung LCD Display Cable
900M-T-1.6D KINGBOX 936 lead-free soldering iron head thermostatic head
Foxconn Socket LGA2066 CPU Base PC Connector BGA Base
